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5023821171 Molex


5023820271_sd.pdf Hersteller: Molex
Conn Wire to Board RCP 1.25mm Solder ST SMD
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Technische Details 5023821171 Molex

Description: 1.25 W/B SGL S/T ASSY11CKTEMBSTP, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Voltage Rating: 50VAC/DC, Current Rating (Amps): 1A, Mounting Type: Surface Mount, Number of Positions: 11, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Natural, Pitch - Mating: 0.049" (1.25mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 3.94µin (0.100µm), Contact Finish - Post: Gold, Insulation Height: 0.181" (4.60mm), Number of Rows: 1.

Weitere Produktangebote 5023821171

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5023821171 Hersteller : Molex Description: 1.25 W/B SGL S/T ASSY11CKTEMBSTP
Features: Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Receptacle
Voltage Rating: 50VAC/DC
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 11
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 3.94µin (0.100µm)
Contact Finish - Post: Gold
Insulation Height: 0.181" (4.60mm)
Number of Rows: 1
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502382-1171 Hersteller : Molex Headers & Wire Housings 1.25 W/B Sgl S/T Assy11CktEmbsTpPkg
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