Technische Details 5023821370 Molex
Description: CONN RCPT 13POS 0.049 TIN SMD, Number of Rows: 1, Insulation Height: 0.173" (4.40mm), Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Mating: Tin, Pitch - Mating: 0.049" (1.25mm), Insulation Color: Natural, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Latch Holder, Contact Type: Forked, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Positions: 13, Mounting Type: Surface Mount, Current Rating (Amps): 1A, Voltage Rating: 50V, Connector Type: Receptacle, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote 5023821370 nach Preis ab 0.9 EUR bis 2.46 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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5023821370 | Molex |
 Conn Wire to Board RCP 13 POS 1.25mm Solder ST Top Entry SMD CLIK-Mate T/R |
auf Bestellung 5600 Stücke: Lieferzeit 14-21 Tag (e) |
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502382-1370 | Molex |
Description: 1.25MM PITCH CLIK-MATE WIRE-TO-B Features: Solder Retention Packaging: Box Connector Type: Receptacle Voltage Rating: 50V Current Rating (Amps): 1A Mounting Type: Surface Mount Number of Positions: 13 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Natural Pitch - Mating: 0.049" (1.25mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.173" (4.40mm) Number of Rows: 1 |
auf Bestellung 12600 Stücke: Lieferzeit 10-14 Tag (e) |
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502382-1370 | Molex |
Headers & Wire Housings 1.25 SGL REC ASSY 13C |
auf Bestellung 5939 Stücke: Lieferzeit 10-14 Tag (e) |
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5023821370 | Molex |
Description: CONN RCPT 13POS 0.049 TIN SMD Voltage Rating: 50V Connector Type: Receptacle Features: Solder Retention Packaging: Cut Tape (CT) Number of Rows: 1 Insulation Height: 0.173" (4.40mm) Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Tin Pitch - Mating: 0.049" (1.25mm) Insulation Color: Natural Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Holder Contact Type: Forked Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Positions: 13 Mounting Type: Surface Mount Current Rating (Amps): 1A |
auf Bestellung 398 Stücke: Lieferzeit 10-14 Tag (e) |
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| 502382-1370 | MOLEX |
Description: MOLEX - 502382-1370 - Printbuchse, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 13 Kontakt(e), Oberflächenmontage Kontaktüberzug: Verzinnte Kontakte Rastermaß: 1.25 Anzahl der Kontakte: 13 Steckverbindersysteme: Signal, Wire-to-Board Anzahl der Reihen: 1 Kontaktmaterial: Kupferlegierung Steckverbindermontage: Oberflächenmontage Produktpalette: CLIK-Mate 502382 SVHC: No SVHC (10-Jun-2022) |
auf Bestellung 2800 Stücke: Lieferzeit 14-21 Tag (e) |
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| 5023821370 |
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Hersteller: Molex
Conn Wire to Board RCP 13 POS 1.25mm Solder ST Top Entry SMD CLIK-Mate T/R
Conn Wire to Board RCP 13 POS 1.25mm Solder ST Top Entry SMD CLIK-Mate T/R
auf Bestellung 5600 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 1.06 EUR |
| 2800+ | 1.01 EUR |
| 5600+ | 0.9 EUR |
| 502382-1370 |
|
Hersteller: Molex
Description: 1.25MM PITCH CLIK-MATE WIRE-TO-B
Features: Solder Retention
Packaging: Box
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 13
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
Description: 1.25MM PITCH CLIK-MATE WIRE-TO-B
Features: Solder Retention
Packaging: Box
Connector Type: Receptacle
Voltage Rating: 50V
Current Rating (Amps): 1A
Mounting Type: Surface Mount
Number of Positions: 13
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Natural
Pitch - Mating: 0.049" (1.25mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.173" (4.40mm)
Number of Rows: 1
auf Bestellung 12600 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 1.3 EUR |
| 2800+ | 1.26 EUR |
| 5600+ | 1.24 EUR |
| 11200+ | 1.18 EUR |
| 502382-1370 |
|
Hersteller: Molex
Headers & Wire Housings 1.25 SGL REC ASSY 13C
Headers & Wire Housings 1.25 SGL REC ASSY 13C
auf Bestellung 5939 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 1.95 EUR |
| 10+ | 1.31 EUR |
| 25+ | 1.3 EUR |
| 100+ | 1.26 EUR |
| 250+ | 1.23 EUR |
| 500+ | 1.19 EUR |
| 1400+ | 1.09 EUR |
| 5023821370 |
|
Hersteller: Molex
Description: CONN RCPT 13POS 0.049 TIN SMD
Voltage Rating: 50V
Connector Type: Receptacle
Features: Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 1
Insulation Height: 0.173" (4.40mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Natural
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Holder
Contact Type: Forked
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Positions: 13
Mounting Type: Surface Mount
Current Rating (Amps): 1A
Description: CONN RCPT 13POS 0.049 TIN SMD
Voltage Rating: 50V
Connector Type: Receptacle
Features: Solder Retention
Packaging: Cut Tape (CT)
Number of Rows: 1
Insulation Height: 0.173" (4.40mm)
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Natural
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Holder
Contact Type: Forked
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Positions: 13
Mounting Type: Surface Mount
Current Rating (Amps): 1A
auf Bestellung 398 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 9+ | 2.45 EUR |
| 11+ | 2.03 EUR |
| 100+ | 1.69 EUR |
| 502382-1370 |
|
Hersteller: MOLEX
Description: MOLEX - 502382-1370 - Printbuchse, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 13 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Verzinnte Kontakte
Rastermaß: 1.25
Anzahl der Kontakte: 13
Steckverbindersysteme: Signal, Wire-to-Board
Anzahl der Reihen: 1
Kontaktmaterial: Kupferlegierung
Steckverbindermontage: Oberflächenmontage
Produktpalette: CLIK-Mate 502382
SVHC: No SVHC (10-Jun-2022)
Description: MOLEX - 502382-1370 - Printbuchse, Signal, Wire-to-Board, 1.25 mm, 1 Reihe(n), 13 Kontakt(e), Oberflächenmontage
Kontaktüberzug: Verzinnte Kontakte
Rastermaß: 1.25
Anzahl der Kontakte: 13
Steckverbindersysteme: Signal, Wire-to-Board
Anzahl der Reihen: 1
Kontaktmaterial: Kupferlegierung
Steckverbindermontage: Oberflächenmontage
Produktpalette: CLIK-Mate 502382
SVHC: No SVHC (10-Jun-2022)
auf Bestellung 2800 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1400+ | 2.46 EUR |