5025841160 Molex
Hersteller: Molex
Description: CONN RCPT 11POS 0.059 TIN SMD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 11
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.059" (1.50mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.287" (7.30mm)
Number of Rows: 1
Description: CONN RCPT 11POS 0.059 TIN SMD
Packaging: Cut Tape (CT)
Features: Solder Retention
Connector Type: Receptacle
Current Rating (Amps): Varies by Wire Gauge
Mounting Type: Surface Mount
Number of Positions: 11
Style: Board to Cable/Wire
Operating Temperature: -40°C ~ 105°C
Contact Type: Forked
Fastening Type: Latch Holder
Number of Positions Loaded: All
Termination: Solder
Material Flammability Rating: UL94 V-0
Insulation Color: Beige
Pitch - Mating: 0.059" (1.50mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Post: Tin
Part Status: Active
Insulation Height: 0.287" (7.30mm)
Number of Rows: 1
auf Bestellung 3251 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
8+ | 2.36 EUR |
100+ | 2.07 EUR |
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Produktbewertung abgeben
Technische Details 5025841160 Molex
Description: CONN RCPT 11POS 0.059 TIN SMD, Packaging: Tape & Reel (TR), Features: Solder Retention, Connector Type: Receptacle, Current Rating (Amps): Varies by Wire Gauge, Mounting Type: Surface Mount, Number of Positions: 11, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 39.4µin (1.00µm), Contact Finish - Post: Tin, Part Status: Active, Insulation Height: 0.287" (7.30mm), Number of Rows: 1.
Weitere Produktangebote 5025841160 nach Preis ab 2.08 EUR bis 3.67 EUR
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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5025841160 | Hersteller : Molex |
Description: CONN RCPT 11POS 0.059 TIN SMD Packaging: Tape & Reel (TR) Features: Solder Retention Connector Type: Receptacle Current Rating (Amps): Varies by Wire Gauge Mounting Type: Surface Mount Number of Positions: 11 Style: Board to Cable/Wire Operating Temperature: -40°C ~ 105°C Contact Type: Forked Fastening Type: Latch Holder Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Insulation Color: Beige Pitch - Mating: 0.059" (1.50mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Post: Tin Part Status: Active Insulation Height: 0.287" (7.30mm) Number of Rows: 1 |
auf Bestellung 2700 Stücke: Lieferzeit 10-14 Tag (e) |
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502584-1160 | Hersteller : Molex | Headers & Wire Housings 1.5 W/B SglSTAssy11CktBeigeEmbsTpPk |
auf Bestellung 2736 Stücke: Lieferzeit 14-28 Tag (e) |
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5025841160 | Hersteller : Molex | Conn Wire to Board RCP 11 POS 1.5mm Solder ST SMD CLIK-Mate™ T/R |
Produkt ist nicht verfügbar |