Technische Details 503304-3040 Molex
Description: CONN RCPT 30POS SMD GOLD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Gold, Mounting Type: Surface Mount, Number of Positions: 30, Pitch: 0.016" (0.40mm), Height Above Board: 0.027" (0.68mm), Contact Finish Thickness: 4.00µin (0.100µm), Mated Stacking Heights: 0.7mm, Number of Rows: 2.
Weitere Produktangebote 503304-3040 nach Preis ab 1.46 EUR bis 1.58 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 503304-3040 | Hersteller : Molex |
Description: 0.4 B/B REC ASSY 30CKT EMBSTP PK Packaging: Bulk |
auf Bestellung 494530 Stücke: Lieferzeit 10-14 Tag (e) |
|
|||||||||
| 5033043040 | Hersteller : Molex |
Description: CONN RCPT 30POS SMD GOLDFeatures: Solder Retention Packaging: Tape & Reel (TR) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.027" (0.68mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.7mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
||||||||||
| 5033043040 | Hersteller : Molex |
Description: CONN RCPT 30POS SMD GOLDFeatures: Solder Retention Packaging: Cut Tape (CT) Connector Type: Receptacle, Center Strip Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 30 Pitch: 0.016" (0.40mm) Height Above Board: 0.027" (0.68mm) Contact Finish Thickness: 4.00µin (0.100µm) Mated Stacking Heights: 0.7mm Number of Rows: 2 |
Produkt ist nicht verfügbar |
