504194-0370
Produktcode: 111466
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Hersteller:
Steckverbinder, Reihenklemmen > Steckverbindungen sonstige
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Weitere Produktangebote 504194-0370 nach Preis ab 1.04 EUR bis 2.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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5041940370 | Molex |
Description: CONN HEADER SMD 3POS 1.25MMInsulation Material: Polyamide (PA), Nylon, Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.163" (4.15mm) Contact Shape: Rectangular Part Status: Active Contact Finish - Post: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Tin Insulation Color: Natural Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Lock Contact Type: Male Blade Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 3 Mounting Type: Surface Mount Connector Type: Header Packaging: Tape & Reel (TR) Pitch - Mating: 0.049" (1.25mm) Features: Solder Retention |
auf Bestellung 7200 Stücke: Lieferzeit 10-14 Tag (e) |
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504194-0370 | MOLEX / PARTNER STOCK |
Description: MOLEX / PARTNER STOCK - 504194-0370 - Stiftleiste, Wire-to-Board, 1.25 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Nennkontaktstrom: 1.5A Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Messing isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 3Kontakt(e) SVHC: No SVHC (04-Feb-2026) Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: Micro-Lock 504194 Series productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade usEccn: EAR99 Steckverbinderausrichtung: Gerade Anzahl der Reihen: 1Reihe(n) Steckverbindermaterial: Gehäuse aus Nylon (Polyamid), glasfaserverstärkt Rastermaß: 1.25mm |
auf Bestellung 79200 Stücke: Lieferzeit 14-21 Tag (e) |
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5041940370 | Molex |
Description: CONN HEADER SMD 3POS 1.25MMInsulation Material: Polyamide (PA), Nylon, Glass Filled Shrouding: Shrouded - 4 Wall Insulation Height: 0.163" (4.15mm) Contact Shape: Rectangular Contact Finish - Post: Tin Contact Finish Thickness - Mating: 39.4µin (1.00µm) Contact Finish - Mating: Tin Pitch - Mating: 0.049" (1.25mm) Insulation Color: Natural Contact Material: Brass Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Lock Contact Type: Male Blade Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 3 Mounting Type: Surface Mount Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) Part Status: Active |
auf Bestellung 7554 Stücke: Lieferzeit 10-14 Tag (e) |
|
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| 504194-0370 | Molex | Description: MICRO-LOCK 1.25 W/B VERT HDR 3CK |
auf Bestellung 3600 Stücke: Lieferzeit 10-14 Tag (e) |
Mindestbestellmenge: 1200 Stücke Im Einkaufswagen Stück im Wert von UAH |
| 5041940370 |
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Hersteller: Molex
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Packaging: Tape & Reel (TR)
Pitch - Mating: 0.049" (1.25mm)
Features: Solder Retention
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Part Status: Active
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Packaging: Tape & Reel (TR)
Pitch - Mating: 0.049" (1.25mm)
Features: Solder Retention
auf Bestellung 7200 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1200+ | 1.17 EUR |
| 2400+ | 1.11 EUR |
| 3600+ | 1.07 EUR |
| 6000+ | 1.04 EUR |
| 504194-0370 |
Hersteller: MOLEX / PARTNER STOCK
Description: MOLEX / PARTNER STOCK - 504194-0370 - Stiftleiste, Wire-to-Board, 1.25 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Nennkontaktstrom: 1.5A
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 3Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Micro-Lock 504194 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Steckverbinderausrichtung: Gerade
Anzahl der Reihen: 1Reihe(n)
Steckverbindermaterial: Gehäuse aus Nylon (Polyamid), glasfaserverstärkt
Rastermaß: 1.25mm
Description: MOLEX / PARTNER STOCK - 504194-0370 - Stiftleiste, Wire-to-Board, 1.25 mm, 1 Reihe(n), 3 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Nennkontaktstrom: 1.5A
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Messing
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 3Kontakt(e)
SVHC: No SVHC (04-Feb-2026)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: Micro-Lock 504194 Series
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Steckverbinderausrichtung: Gerade
Anzahl der Reihen: 1Reihe(n)
Steckverbindermaterial: Gehäuse aus Nylon (Polyamid), glasfaserverstärkt
Rastermaß: 1.25mm
auf Bestellung 79200 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1200+ | 1.57 EUR |
| 3600+ | 1.37 EUR |
| 5041940370 |
![]() |
Hersteller: Molex
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Part Status: Active
Description: CONN HEADER SMD 3POS 1.25MM
Insulation Material: Polyamide (PA), Nylon, Glass Filled
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.163" (4.15mm)
Contact Shape: Rectangular
Contact Finish - Post: Tin
Contact Finish Thickness - Mating: 39.4µin (1.00µm)
Contact Finish - Mating: Tin
Pitch - Mating: 0.049" (1.25mm)
Insulation Color: Natural
Contact Material: Brass
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Blade
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 3
Mounting Type: Surface Mount
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Part Status: Active
auf Bestellung 7554 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 10+ | 2.12 EUR |
| 13+ | 1.74 EUR |
| 100+ | 1.42 EUR |
| 500+ | 1.23 EUR |
| 504194-0370 |
Hersteller: Molex
Description: MICRO-LOCK 1.25 W/B VERT HDR 3CK
Description: MICRO-LOCK 1.25 W/B VERT HDR 3CK
auf Bestellung 3600 Stücke:
Lieferzeit 10-14 Tag (e)



