Technische Details 505406-2860 Molex
Description: CONN RCPT 28POS 0.059 GOLD SMD, Features: Solder Retention, Packaging: Tape & Reel (TR), Connector Type: Receptacle, Mounting Type: Surface Mount, Number of Positions: 28, Style: Board to Cable/Wire, Operating Temperature: -40°C ~ 105°C, Contact Type: Forked, Fastening Type: Latch Holder, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Insulation Color: Beige, Pitch - Mating: 0.059" (1.50mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 8.00µin (0.203µm), Contact Finish - Post: Tin, Insulation Height: 0.344" (8.75mm), Number of Rows: 2.
Weitere Produktangebote 505406-2860 nach Preis ab 4.16 EUR bis 6.44 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 5054062860 | Molex |
Conn Wire to Board RCP 28 POS 1.5mm Solder ST SMD T/R |
auf Bestellung 144 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 5054062860 |
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Hersteller: Molex
Conn Wire to Board RCP 28 POS 1.5mm Solder ST SMD T/R
Conn Wire to Board RCP 28 POS 1.5mm Solder ST SMD T/R
auf Bestellung 144 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 28+ | 6.44 EUR |
| 33+ | 4.95 EUR |
| 50+ | 4.72 EUR |
| 100+ | 4.16 EUR |

