50951-0084N-001 Aces Connectors
Hersteller: Aces Connectors
Description: 1.27MM SPI ROM SOCKET CONN SMT S
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 80.0µin (2.03µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Material - Post: Copper Alloy
Description: 1.27MM SPI ROM SOCKET CONN SMT S
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 80.0µin (2.03µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Material - Post: Copper Alloy
auf Bestellung 1000 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis ohne MwSt |
---|---|
1000+ | 2.05 EUR |
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Technische Details 50951-0084N-001 Aces Connectors
Description: 1.27MM SPI ROM SOCKET CONN SMT S, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: SIP, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 80.0µin (2.03µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 50951-0084N-001
Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
---|---|---|---|---|---|
50951-0084N-001 | Hersteller : Aces Connectors |
Description: 1.27MM SPI ROM SOCKET CONN SMT S Packaging: Cut Tape (CT) Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 80.0µin (2.03µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 80.0µin (2.03µm) Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |