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50951-0084N-001

50951-0084N-001 Aces Connectors


50951-xxxxx-xxx-aces%20rev-H.pdf Hersteller: Aces Connectors
Description: 1.27MM SPI ROM SOCKET CONN SMT S
Packaging: Tape & Reel (TR)
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 80.0µin (2.03µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Material - Post: Copper Alloy
auf Bestellung 1000 Stücke:

Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1000+2.05 EUR
Mindestbestellmenge: 1000
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Technische Details 50951-0084N-001 Aces Connectors

Description: 1.27MM SPI ROM SOCKET CONN SMT S, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: SIP, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 80.0µin (2.03µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 80.0µin (2.03µm), Contact Material - Post: Copper Alloy.

Weitere Produktangebote 50951-0084N-001

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50951-0084N-001 50951-0084N-001 Hersteller : Aces Connectors 50951-xxxxx-xxx-aces%20rev-H.pdf Description: 1.27MM SPI ROM SOCKET CONN SMT S
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 80.0µin (2.03µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 80.0µin (2.03µm)
Contact Material - Post: Copper Alloy
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