50960-0084N-001 Aces Connectors
Hersteller: Aces Connectors
Description: 1.27MM PITCH SPI FLASH SOCKET CO
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
Description: 1.27MM PITCH SPI FLASH SOCKET CO
Packaging: Cut Tape (CT)
Mounting Type: Surface Mount
Type: SIP
Number of Positions or Pins (Grid): 8
Termination: Solder
Housing Material: Thermoplastic
Pitch - Mating: 0.050" (1.27mm)
Contact Finish - Mating: Tin
Contact Finish Thickness - Mating: 100.0µin (2.54µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.050" (1.27mm)
Contact Finish - Post: Tin
Contact Finish Thickness - Post: 100.0µin (2.54µm)
Contact Material - Post: Copper Alloy
auf Bestellung 694 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 5+ | 3.7 EUR |
| 10+ | 3.21 EUR |
| 25+ | 3.07 EUR |
| 50+ | 3 EUR |
| 100+ | 2.87 EUR |
| 250+ | 2.59 EUR |
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Technische Details 50960-0084N-001 Aces Connectors
Description: 1.27MM PITCH SPI FLASH SOCKET CO, Packaging: Tape & Reel (TR), Mounting Type: Surface Mount, Type: SIP, Number of Positions or Pins (Grid): 8, Termination: Solder, Housing Material: Thermoplastic, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Tin, Contact Finish Thickness - Mating: 100.0µin (2.54µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.050" (1.27mm), Contact Finish - Post: Tin, Contact Finish Thickness - Post: 100.0µin (2.54µm), Contact Material - Post: Copper Alloy.
Weitere Produktangebote 50960-0084N-001
| Foto | Bezeichnung | Hersteller | Beschreibung |
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50960-0084N-001 | Hersteller : Aces Connectors |
Description: 1.27MM PITCH SPI FLASH SOCKET CO Packaging: Tape & Reel (TR) Mounting Type: Surface Mount Type: SIP Number of Positions or Pins (Grid): 8 Termination: Solder Housing Material: Thermoplastic Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Tin Contact Finish Thickness - Mating: 100.0µin (2.54µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.050" (1.27mm) Contact Finish - Post: Tin Contact Finish Thickness - Post: 100.0µin (2.54µm) Contact Material - Post: Copper Alloy |
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