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510-83-179-18-111101

510-83-179-18-111101 Preci-dip

Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101
Hersteller: Preci-dip
IC & Component Sockets
auf Bestellung 26 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+52.49 EUR
11+44.59 EUR
22+41.78 EUR
55+38.14 EUR
110+37.39 EUR
264+36.15 EUR
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Technische Details 510-83-179-18-111101 Preci-dip

Description: CONN SOCKET PGA 179POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 179 (18 x 18), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.

Weitere Produktangebote 510-83-179-18-111101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
510-83-179-18-111101 510-83-179-18-111101 Preci-Dip Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101 Description: CONN SOCKET PGA 179POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
 Mindestbestellmenge: 264 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
510-83-179-18-111101 Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101
510-83-179-18-111101
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 179POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 179 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
Produkt ist nicht verfügbar
Mindestbestellmenge: 264 Stücke
Im Einkaufswagen  Stück im Wert von  UAH