auf Bestellung 5 Stücke:
Lieferzeit 14-28 Tag (e)
| Anzahl | Preis ohne MwSt |
|---|---|
| 2+ | 45.6 EUR |
| 11+ | 39.55 EUR |
| 22+ | 37.49 EUR |
| 55+ | 36.92 EUR |
| 110+ | 32.6 EUR |
| 264+ | 30.42 EUR |
| 528+ | 29.77 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 510-83-179-18-111101 Preci-dip
Description: CONN SOCKET PGA 179POS GOLD, Packaging: Bulk, Features: Open Frame, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 179 (18 x 18), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.
Weitere Produktangebote 510-83-179-18-111101
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis ohne MwSt |
|---|---|---|---|---|---|
 |
510-83-179-18-111101 | Hersteller : Preci-Dip |
 Pin grid array sockets, standard solder version |
Produkt ist nicht verfügbar |
|
 |
510-83-179-18-111101 | Hersteller : Preci-Dip |
Description: CONN SOCKET PGA 179POS GOLD Packaging: Bulk Features: Open Frame Mounting Type: Through Hole Type: PGA Operating Temperature: -55°C ~ 125°C Number of Positions or Pins (Grid): 179 (18 x 18) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 29.5µin (0.75µm) Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Brass Part Status: Active |
Produkt ist nicht verfügbar |