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510-87-225-18-091101

510-87-225-18-091101 Preci-dip


Catalog-1062742.pdf Hersteller: Preci-dip
IC & Component Sockets
auf Bestellung 11 Stücke:

Lieferzeit 14-28 Tag (e)
Anzahl Preis ohne MwSt
2+37.67 EUR
11+ 33.38 EUR
22+ 32.11 EUR
110+ 29.12 EUR
264+ 26.55 EUR
528+ 24.83 EUR
1056+ 22.78 EUR
Mindestbestellmenge: 2
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Technische Details 510-87-225-18-091101 Preci-dip

Description: CONN SOCKET PGA 225POS GOLD, Features: Open Frame, Packaging: Bulk, Mounting Type: Through Hole, Type: PGA, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 225 (18 x 18), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: FLASH, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Brass, Part Status: Active.

Weitere Produktangebote 510-87-225-18-091101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit
Preis ohne MwSt
510-87-225-18-091101 Hersteller : Preci-Dip Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101 Description: CONN SOCKET PGA 225POS GOLD
Features: Open Frame
Packaging: Bulk
Mounting Type: Through Hole
Type: PGA
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 225 (18 x 18)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: FLASH
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin
Contact Material - Post: Brass
Part Status: Active
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