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510-87-281-19-081101

510-87-281-19-081101 Preci-dip

Catalog-1062742.pdf
Hersteller: Preci-dip
IC & Component Sockets
auf Bestellung 12 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+36.19 EUR
11+31.36 EUR
22+29.71 EUR
55+29.3 EUR
110+25.85 EUR
176+24.13 EUR
528+23.61 EUR
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Technische Details 510-87-281-19-081101 Preci-dip

Description: CONN SOCKET PGA 281POS GOLD, Number of Positions or Pins (Grid): 281 (19 x 19), Operating Temperature: -55°C ~ 125°C, Type: PGA, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: FLASH, Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder.

Weitere Produktangebote 510-87-281-19-081101

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
510-87-281-19-081101 Preci-Dip Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101 Description: CONN SOCKET PGA 281POS GOLD
Number of Positions or Pins (Grid): 281 (19 x 19)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Produkt ist nicht verfügbar
 Mindestbestellmenge: 176 Stücke
Im Einkaufswagen  Stück im Wert von  UAH
510-87-281-19-081101 Default.aspx?c=12&i=1061&p=267&pdf=1&dsku=510-PP-NNN-XX-XXX101
Hersteller: Preci-Dip
Description: CONN SOCKET PGA 281POS GOLD
Number of Positions or Pins (Grid): 281 (19 x 19)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: FLASH
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Produkt ist nicht verfügbar
Mindestbestellmenge: 176 Stücke
Im Einkaufswagen  Stück im Wert von  UAH