511-93-238-19-086002 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 238 (19 x 19)
Operating Temperature: -55°C ~ 125°C
Type: PGA
Mounting Type: Through Hole
Features: Open Frame
Packaging: Bulk
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
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Technische Details 511-93-238-19-086002 Mill-Max Manufacturing Corp.
Description: SKT PGA SOLDRTL, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 238 (19 x 19), Operating Temperature: -55°C ~ 125°C, Type: PGA, Mounting Type: Through Hole, Features: Open Frame, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm).
Weitere Produktangebote 511-93-238-19-086002
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 511-93-238-19-086002 | Hersteller : Mill-Max |
Circuit Board Hardware - PCB STANDRD SOLDER TAIL PGA SOCKET |
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