514-83-360M19-001148 Preci-Dip
Hersteller: Preci-Dip
Description: CONN SOCKET BGA 360POS GOLD
Part Status: Active
Contact Material - Post: Brass
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 29.5µin (0.75µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
Termination: Solder
Number of Positions or Pins (Grid): 360 (19 x 19)
Operating Temperature: -55°C ~ 125°C
Type: BGA
Mounting Type: Surface Mount
Features: Open Frame
Packaging: Bulk
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Technische Details 514-83-360M19-001148 Preci-Dip
Description: CONN SOCKET BGA 360POS GOLD, Part Status: Active, Contact Material - Post: Brass, Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 29.5µin (0.75µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled, Termination: Solder, Number of Positions or Pins (Grid): 360 (19 x 19), Operating Temperature: -55°C ~ 125°C, Type: BGA, Mounting Type: Surface Mount, Features: Open Frame, Packaging: Bulk.
Weitere Produktangebote 514-83-360M19-001148
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 514-83-360M19-001148 | Hersteller : Preci-dip |
IC & Component Sockets |
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