516-AG12D-LF TE Connectivity
auf Bestellung 1110 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 35+ | 4.18 EUR |
| 150+ | 3.96 EUR |
| 270+ | 3.73 EUR |
| 510+ | 3.52 EUR |
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Technische Details 516-AG12D-LF TE Connectivity
Description: CONN IC DIP SOCKET 16POS TIN, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 16 (2 x 8), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Tin, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin, Contact Material - Post: Beryllium Copper.
Weitere Produktangebote 516-AG12D-LF nach Preis ab 7.08 EUR bis 7.08 EUR
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516-AG12D-LF | Hersteller : TE Connectivity |
 Conn DIP Socket SKT 16 POS 2.54mm Solder ST Thru-Hole Tube |
auf Bestellung 120 Stücke: Lieferzeit 14-21 Tag (e) |
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516-AG12D-LF | Hersteller : TE Connectivity AMP Connectors |
Description: CONN IC DIP SOCKET 16POS TIN Features: Closed Frame Packaging: Tube Mounting Type: Through Hole Type: DIP, 0.3" (7.62mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 16 (2 x 8) Termination: Solder Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Tin Contact Material - Mating: Beryllium Copper Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin Contact Material - Post: Beryllium Copper |
Produkt ist nicht verfügbar |