51645 QOLTEC
Hersteller: QOLTEC
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 1g
Type of chemical agent: heat transfer paste
Colour: silver
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 3.17W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 1g
Thermal resistance: max. 0.067°C/W
Category: Heat conductive compounds
Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 1g
Type of chemical agent: heat transfer paste
Colour: silver
Agent features: easy aplication; perfect insulation; thermally conductive
Thermal conductivity: 3.17W/mK
Kind of package: syringe
Application: filling joints and micro-gaps between the processor and the base of the cooling system
Net weight: 1g
Thermal resistance: max. 0.067°C/W
auf Bestellung 47 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 31+ | 2.36 EUR |
| 33+ | 2.23 EUR |
| 35+ | 2.09 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 51645 QOLTEC
Category: Heat conductive compounds, Description: Heat transfer paste; silver; 3.17W/mK; max.0.067°C/W; 1g, Type of chemical agent: heat transfer paste, Colour: silver, Agent features: easy aplication; perfect insulation; thermally conductive, Thermal conductivity: 3.17W/mK, Kind of package: syringe, Application: filling joints and micro-gaps between the processor and the base of the cooling system, Net weight: 1g, Thermal resistance: max. 0.067°C/W.