520-AG10D-ES TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP ConnectorsDescription: CONN IC DIP SOCKET 20POS GOLD
Features: Closed Frame
Packaging: Tube
Mounting Type: Through Hole
Type: DIP, 0.3" (7.62mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 20 (2 x 10)
Termination: Solder
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Material - Post: Brass
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Technische Details 520-AG10D-ES TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 20POS GOLD, Features: Closed Frame, Packaging: Tube, Mounting Type: Through Hole, Type: DIP, 0.3" (7.62mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 20 (2 x 10), Termination: Solder, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Material - Post: Brass.
Weitere Produktangebote 520-AG10D-ES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
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520-AG10D-ES | Hersteller : TE Connectivity / AMP |
IC & Component Sockets 20P MACH DIP SKT |
Produkt ist nicht verfügbar |