524-AG11D-ES TE Connectivity AMP Connectors
Hersteller: TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 24POS GOLD
Packaging: Bulk
Features: Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.6" (15.24mm) Row Spacing
Operating Temperature: -55°C ~ 105°C
Number of Positions or Pins (Grid): 24 (2 x 12)
Termination: Solder
Housing Material: Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 25.0µin (0.63µm)
Contact Material - Mating: Copper Alloy
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Tin-Lead
Contact Material - Post: Copper Alloy
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Technische Details 524-AG11D-ES TE Connectivity AMP Connectors
Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Material - Post: Copper Alloy.
Weitere Produktangebote 524-AG11D-ES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
524-AG11D-ES | TE Connectivity / AMP |
IC & Component Sockets PC MOUNT 24 PINS 500 |
Produkt ist nicht verfügbar |
Im Einkaufswagen Stück im Wert von UAH |
| 524-AG11D-ES |
|
Hersteller: TE Connectivity / AMP
IC & Component Sockets PC MOUNT 24 PINS 500
IC & Component Sockets PC MOUNT 24 PINS 500
Produkt ist nicht verfügbar
Im Einkaufswagen
Stück im Wert von UAH