524-AG11D-ES TE Connectivity
auf Bestellung 74 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 30+ | 4.95 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 524-AG11D-ES TE Connectivity
Description: CONN IC DIP SOCKET 24POS GOLD, Packaging: Bulk, Features: Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.6" (15.24mm) Row Spacing, Operating Temperature: -55°C ~ 105°C, Number of Positions or Pins (Grid): 24 (2 x 12), Termination: Solder, Housing Material: Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 25.0µin (0.63µm), Contact Material - Mating: Copper Alloy, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Tin-Lead, Contact Material - Post: Copper Alloy.
Weitere Produktangebote 524-AG11D-ES
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
 |
524-AG11D-ES | Hersteller : TE Connectivity AMP Connectors |
 Description: CONN IC DIP SOCKET 24POS GOLDPackaging: Bulk Features: Closed Frame Mounting Type: Through Hole Type: DIP, 0.6" (15.24mm) Row Spacing Operating Temperature: -55°C ~ 105°C Number of Positions or Pins (Grid): 24 (2 x 12) Termination: Solder Housing Material: Polyester Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 25.0µin (0.63µm) Contact Material - Mating: Copper Alloy Pitch - Post: 0.100" (2.54mm) Contact Finish - Post: Tin-Lead Contact Material - Post: Copper Alloy |
Produkt ist nicht verfügbar |
|
 |
524-AG11D-ES | Hersteller : TE Connectivity / AMP |
IC & Component Sockets PC MOUNT 24 PINS 500 |
Produkt ist nicht verfügbar |