Suchergebnisse für "529367" : 9
Art der Ansicht :
Mindestbestellmenge: 19
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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DB101-BP | Micro Commercial Co |
Description: BRIDGE RECT 1PHASE 50V 1A DB-1 Packaging: Tube Package / Case: 4-EDIP (0.321", 8.15mm) Mounting Type: Through Hole Diode Type: Single Phase Operating Temperature: -55°C ~ 150°C (TJ) Technology: Standard Supplier Device Package: DB-1 Voltage - Peak Reverse (Max): 50 V Current - Average Rectified (Io): 1 A Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A Current - Reverse Leakage @ Vr: 10 µA @ 50 V |
auf Bestellung 9214 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1820FET100,551 | NXP Semiconductors |
 ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US |
auf Bestellung 520 Stücke: Lieferzeit 10-14 Tag (e) |
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LPC1820FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 168K x 8 Operating Temperature: -40°C ~ 85°C (TA) Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Part Status: Active Number of I/O: 64 DigiKey Programmable: Not Verified |
auf Bestellung 135 Stücke: Lieferzeit 10-14 Tag (e) |
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| 14529367 | Bussmann / Eaton | Power Outlet Strips G3HD-MA HW D48A 15C13 9C13+3C19 |
Produkt ist nicht verfügbar |
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| 55A1832-24-4/5/6-3CS356 | TE Connectivity Raychem Cable Protection |
Description: CABLE 3COND 24AWG ORANGE SHLD Packaging: Bulk Wire Gauge: 24 AWG Jacket (Insulation) Material: Fluoropolymer Conductor Strand: 19/36 Operating Temperature: 200°C Number of Conductors: 3 Cable Type: Multi-Conductor Jacket (Insulation) Diameter: 0.130" (3.30mm) Jacket (Insulation) Thickness: 0.0075" (0.191mm) Shield Type: Braid Conductor Material: Copper, Silver Coated Jacket Color: Orange Voltage: 600 V |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | NXP USA Inc. |
Description: IC MCU 32BIT ROMLESS 100TFBGA Packaging: Tray Package / Case: 100-TFBGA Mounting Type: Surface Mount Speed: 150MHz RAM Size: 136K x 8 Operating Temperature: -40°C ~ 85°C Oscillator Type: Internal Program Memory Type: ROMless Core Processor: ARM® Cortex®-M3 Data Converters: A/D 12x10b; D/A 1x10b Core Size: 32-Bit Single-Core Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT Supplier Device Package: 100-TFBGA (9x9) Number of I/O: 64 DigiKey Programmable: Not Verified |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | NXP Semiconductors |
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray |
Produkt ist nicht verfügbar |
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LPC1810FET100,551 | NXP Semiconductors |
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US |
Produkt ist nicht verfügbar |
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LPC1820FET100,551 | NXP Semiconductors |
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray |
Produkt ist nicht verfügbar |
| DB101-BP |
Hersteller: Micro Commercial Co
Description: BRIDGE RECT 1PHASE 50V 1A DB-1
Packaging: Tube
Package / Case: 4-EDIP (0.321", 8.15mm)
Mounting Type: Through Hole
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: DB-1
Voltage - Peak Reverse (Max): 50 V
Current - Average Rectified (Io): 1 A
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
Description: BRIDGE RECT 1PHASE 50V 1A DB-1
Packaging: Tube
Package / Case: 4-EDIP (0.321", 8.15mm)
Mounting Type: Through Hole
Diode Type: Single Phase
Operating Temperature: -55°C ~ 150°C (TJ)
Technology: Standard
Supplier Device Package: DB-1
Voltage - Peak Reverse (Max): 50 V
Current - Average Rectified (Io): 1 A
Voltage - Forward (Vf) (Max) @ If: 1.1 V @ 1 A
Current - Reverse Leakage @ Vr: 10 µA @ 50 V
auf Bestellung 9214 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 19+ | 0.95 EUR |
| 50+ | 0.76 EUR |
| 100+ | 0.56 EUR |
| 500+ | 0.44 EUR |
| 1000+ | 0.36 EUR |
| 2000+ | 0.32 EUR |
| 5000+ | 0.3 EUR |
| LPC1820FET100,551 |
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Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
auf Bestellung 520 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.55 EUR |
| 10+ | 12.72 EUR |
| 100+ | 11.21 EUR |
| 260+ | 10.31 EUR |
| LPC1820FET100,551 |
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Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 168K x 8
Operating Temperature: -40°C ~ 85°C (TA)
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, USB OTG
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Part Status: Active
Number of I/O: 64
DigiKey Programmable: Not Verified
auf Bestellung 135 Stücke:
Lieferzeit 10-14 Tag (e)| Anzahl | Preis ohne MwSt |
|---|---|
| 1+ | 19.69 EUR |
| 10+ | 15.47 EUR |
| 80+ | 12.81 EUR |
| 14529367 |
Hersteller: Bussmann / Eaton
Power Outlet Strips G3HD-MA HW D48A 15C13 9C13+3C19
Power Outlet Strips G3HD-MA HW D48A 15C13 9C13+3C19
Produkt ist nicht verfügbar
| 55A1832-24-4/5/6-3CS356 |
|
Hersteller: TE Connectivity Raychem Cable Protection
Description: CABLE 3COND 24AWG ORANGE SHLD
Packaging: Bulk
Wire Gauge: 24 AWG
Jacket (Insulation) Material: Fluoropolymer
Conductor Strand: 19/36
Operating Temperature: 200°C
Number of Conductors: 3
Cable Type: Multi-Conductor
Jacket (Insulation) Diameter: 0.130" (3.30mm)
Jacket (Insulation) Thickness: 0.0075" (0.191mm)
Shield Type: Braid
Conductor Material: Copper, Silver Coated
Jacket Color: Orange
Voltage: 600 V
Description: CABLE 3COND 24AWG ORANGE SHLD
Packaging: Bulk
Wire Gauge: 24 AWG
Jacket (Insulation) Material: Fluoropolymer
Conductor Strand: 19/36
Operating Temperature: 200°C
Number of Conductors: 3
Cable Type: Multi-Conductor
Jacket (Insulation) Diameter: 0.130" (3.30mm)
Jacket (Insulation) Thickness: 0.0075" (0.191mm)
Shield Type: Braid
Conductor Material: Copper, Silver Coated
Jacket Color: Orange
Voltage: 600 V
Produkt ist nicht verfügbar
| LPC1810FET100,551 |
|
Hersteller: NXP USA Inc.
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
Produkt ist nicht verfügbar
| LPC1810FET100,551 |
|
Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray
Produkt ist nicht verfügbar
| LPC1810FET100,551 |
|
Hersteller: NXP Semiconductors
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
Produkt ist nicht verfügbar
| LPC1820FET100,551 |
|
Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray
Produkt ist nicht verfügbar