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LPC1810FET100,551

LPC1810FET100,551 NXP Semiconductors


419lpc1850_30_20_10.pdf Hersteller: NXP Semiconductors
MCU 32-bit ARM Cortex M3 RISC ROMLess 2.5V/3.3V 100-Pin TFBGA Tray
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Technische Details LPC1810FET100,551 NXP Semiconductors

Description: IC MCU 32BIT ROMLESS 100TFBGA, Packaging: Tray, Package / Case: 100-TFBGA, Mounting Type: Surface Mount, Speed: 150MHz, RAM Size: 136K x 8, Operating Temperature: -40°C ~ 85°C, Oscillator Type: Internal, Program Memory Type: ROMless, Core Processor: ARM® Cortex®-M3, Data Converters: A/D 12x10b; D/A 1x10b, Core Size: 32-Bit Single-Core, Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V, Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART, Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT, Supplier Device Package: 100-TFBGA (9x9), Number of I/O: 64, DigiKey Programmable: Not Verified.

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LPC1810FET100,551 LPC1810FET100,551 Hersteller : NXP USA Inc. LPC1850_30_20_10.pdf Description: IC MCU 32BIT ROMLESS 100TFBGA
Packaging: Tray
Package / Case: 100-TFBGA
Mounting Type: Surface Mount
Speed: 150MHz
RAM Size: 136K x 8
Operating Temperature: -40°C ~ 85°C
Oscillator Type: Internal
Program Memory Type: ROMless
Core Processor: ARM® Cortex®-M3
Data Converters: A/D 12x10b; D/A 1x10b
Core Size: 32-Bit Single-Core
Voltage - Supply (Vcc/Vdd): 2V ~ 3.6V
Connectivity: CANbus, EBI/EMI, I2C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals: Brown-out Detect/Reset, DMA, I2S, Motor Control PWM, POR, PWM, WDT
Supplier Device Package: 100-TFBGA (9x9)
Number of I/O: 64
DigiKey Programmable: Not Verified
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LPC1810FET100,551 LPC1810FET100,551 Hersteller : NXP Semiconductors LPC1850_30_20_10-1893377.pdf ARM Microcontrollers - MCU 32B ARM CORTEXM3 MCU 200KB SRAM HI-SP US
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