530733-3 TE Connectivity
Hersteller: TE ConnectivityConn Board to Board HDR 60 POS 1.27mm Solder RA Side Entry Thru-Hole Package
auf Bestellung 132 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 220.82 EUR |
| 12+ | 209.13 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 530733-3 TE Connectivity
Description: CONN HEADER R/A 60POS 1.27MM, Features: Mating Guide, Mounting Flange, Packaging: Bulk, Connector Type: Header, Mounting Type: Through Hole, Right Angle, Number of Positions: 60, Number of Rows: 2, Style: Board to Board or Cable, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Contact Material: Brass, Insulation Color: Gray, Pitch - Mating: 0.050" (1.27mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Post: Tin, Contact Shape: Square, Insulation Height: 0.310" (7.87mm), Shrouding: Shrouded - 1 Wall, Insulation Material: Liquid Crystal Polymer (LCP), Row Spacing - Mating: 0.150" (3.81mm).
Weitere Produktangebote 530733-3 nach Preis ab 235.02 EUR bis 239.3 EUR
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530733-3 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 530733-3 - MINI-BX PIN HDR ASY 60 POS RAtariffCode: 85366930 productTraceability: No rohsCompliant: NO euEccn: NLR hazardous: false rohsPhthalatesCompliant: NO usEccn: EAR99 SVHC: To Be Advised |
auf Bestellung 106 Stücke: Lieferzeit 14-21 Tag (e) |
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| 530733-3 | Hersteller : TE Connectivity |
Category: Board-to-board connectorsDescription: Connector: PCB to PCB |
auf Bestellung 132 Stücke: Lieferzeit 14-21 Tag (e) |
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| 530733-3 | Hersteller : TE Connectivity Aerospace, Defense and Marine |
Description: CONN HEADER R/A 60POS 1.27MMFeatures: Mating Guide, Mounting Flange Packaging: Bulk Connector Type: Header Mounting Type: Through Hole, Right Angle Number of Positions: 60 Number of Rows: 2 Style: Board to Board or Cable Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Contact Material: Brass Insulation Color: Gray Pitch - Mating: 0.050" (1.27mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 30.0µin (0.76µm) Contact Finish - Post: Tin Contact Shape: Square Insulation Height: 0.310" (7.87mm) Shrouding: Shrouded - 1 Wall Insulation Material: Liquid Crystal Polymer (LCP) Row Spacing - Mating: 0.150" (3.81mm) |
Produkt ist nicht verfügbar |
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530733-3 | Hersteller : TE Connectivity / AMP |
Headers & Wire Housings MINI-BX PIN HDR ASY 60 POS RA |
Produkt ist nicht verfügbar |

