Technische Details 531129-8 TE Connectivity
Description: CONN RCPT 70POS 0.075 GOLD PCB, Features: Mating Guide, Packaging: Bulk, Connector Type: Receptacle, Mounting Type: Through Hole, Number of Positions: 70, Style: Board to Board, Contact Type: Female Socket, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder Eyelet, Insulation Color: Blue, Pitch - Mating: 0.075" (1.91mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 50.0µin (1.27µm), Contact Finish - Post: Tin-Lead, Part Status: Active, Contact Length - Post: 0.200" (5.08mm), Insulation Height: 0.400" (10.16mm), Row Spacing - Mating: 0.125" (3.18mm), Number of Rows: 2.
Weitere Produktangebote 531129-8
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
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531129-8 | Hersteller : TE Connectivity |
 Conn Board to Board RCP 70 POS 1.91mm Solder Lug ST Thru-Hole Package |
Produkt ist nicht verfügbar |
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| 531129-8 | Hersteller : TE Connectivity Aerospace, Defense and Marine |
Description: CONN RCPT 70POS 0.075 GOLD PCB Features: Mating Guide Packaging: Bulk Connector Type: Receptacle Mounting Type: Through Hole Number of Positions: 70 Style: Board to Board Contact Type: Female Socket Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Eyelet Insulation Color: Blue Pitch - Mating: 0.075" (1.91mm) Contact Finish - Mating: Gold Contact Finish Thickness - Mating: 50.0µin (1.27µm) Contact Finish - Post: Tin-Lead Part Status: Active Contact Length - Post: 0.200" (5.08mm) Insulation Height: 0.400" (10.16mm) Row Spacing - Mating: 0.125" (3.18mm) Number of Rows: 2 |
Produkt ist nicht verfügbar |
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531129-8 | Hersteller : TE Connectivity / AMP |
Headers & Wire Housings 2 ROW RECP 70 POS |
Produkt ist nicht verfügbar |