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533502B02552G

533502B02552G Boyd Laconia, LLC


Board-Level-Cooling-Extruded-5334.pdf
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK
Shape: Rectangular, Fins
Length: 1.650" (41.91mm)
Material: Aluminum
Packaging: Bulk
Material Finish: Black Anodized
Fin Height: 2.000" (50.80mm)
Thermal Resistance @ Natural: 4.50°C/W
Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM
Power Dissipation @ Temperature Rise: 6.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: TO-220
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
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Technische Details 533502B02552G Boyd Laconia, LLC

Description: BOARD LEVEL HEAT SINK, Shape: Rectangular, Fins, Length: 1.650" (41.91mm), Material: Aluminum, Packaging: Bulk, Material Finish: Black Anodized, Fin Height: 2.000" (50.80mm), Thermal Resistance @ Natural: 4.50°C/W, Thermal Resistance @ Forced Air Flow: 1.00°C/W @ 800 LFM, Power Dissipation @ Temperature Rise: 6.0W @ 30°C, Attachment Method: Clip and PC Pin, Package Cooled: TO-220, Width: 1.000" (25.40mm), Type: Board Level, Vertical.

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533502B02552G 533502B02552G Hersteller : Aavid Aavid_01112021_Board_Level_Cooling_Extruded_5334-1953692.pdf Heat Sinks Heat Sink, TO220, Vertical, 4.5 C/W, 2.67mm, Device Clip #52 Hole, 50.8x18.29mm
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Im Einkaufswagen  Stück im Wert von  UAH