533802B02500G Boyd Laconia, LLC
Hersteller: Boyd Laconia, LLCDescription: BOARD LEVEL HEAT SINK
Packaging: Bulk
Material: Aluminum
Length: 1.000" (25.40mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 1.375" (34.93mm)
Package Cooled: TO-220
Attachment Method: PC Pin
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM
Thermal Resistance @ Natural: 13.00°C/W
Fin Height: 0.500" (12.70mm)
Material Finish: Black Anodized
auf Bestellung 2091 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 3+ | 7.78 EUR |
| 10+ | 6.9 EUR |
| 25+ | 6.57 EUR |
| 50+ | 6.33 EUR |
| 100+ | 6.1 EUR |
| 250+ | 5.81 EUR |
| 540+ | 5.58 EUR |
| 1080+ | 5.38 EUR |
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Technische Details 533802B02500G Boyd Laconia, LLC
Description: BOARD LEVEL HEAT SINK, Packaging: Bulk, Material: Aluminum, Length: 1.000" (25.40mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 1.375" (34.93mm), Package Cooled: TO-220, Attachment Method: PC Pin, Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 700 LFM, Thermal Resistance @ Natural: 13.00°C/W, Fin Height: 0.500" (12.70mm), Material Finish: Black Anodized.
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