53647-1074 MOLEX
Hersteller: MOLEX
Category: Board-to-board connectors
Description: Connector: PCB to PCB; PIN: 100; vertical; Inom: 500mA; 100V; SMT
Contact plating: gold-plated
Mechanical mounting: on PCBs
Type of connector: PCB to PCB
Electrical mounting: SMT
Operating temperature: -55...105°C
Contacts pitch: 0.635mm
Height: 7mm
Current rating: 0.5A
Maximum current: 0.5A
Number of pins: 100
Rated voltage: 100V
Spatial orientation: vertical
Produktrezensionen
Produktbewertung abgeben
Technische Details 53647-1074 MOLEX
Category: Board-to-board connectors, Description: Connector: PCB to PCB; PIN: 100; vertical; Inom: 500mA; 100V; SMT, Contact plating: gold-plated, Mechanical mounting: on PCBs, Type of connector: PCB to PCB, Electrical mounting: SMT, Operating temperature: -55...105°C, Contacts pitch: 0.635mm, Height: 7mm, Current rating: 0.5A, Maximum current: 0.5A, Number of pins: 100, Rated voltage: 100V, Spatial orientation: vertical.
Weitere Produktangebote 53647-1074 nach Preis ab 6.95 EUR bis 11.29 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
|
53647-1074 | Molex |
Description: Conn 0.635 BtB Hsg Cover Assy EmFeatures: Board Guide, Solder Retention Packaging: Tape & Reel (TR) Connector Type: Plug, Outer Shroud Contacts Contact Finish: Gold Mounting Type: Surface Mount Number of Positions: 100 Pitch: 0.025" (0.64mm) Height Above Board: 0.276" (7.01mm) Contact Finish Thickness: 10.0µin (0.25µm) Mated Stacking Heights: 8mm, 14mm Number of Rows: 2 |
auf Bestellung 2520 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||
|
53647-1074 | Molex |
Board to Board & Mezzanine Connectors 0.635 BtB Hsg Cover Assy EmbsTpPkg100Ckt |
auf Bestellung 1963 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 53647-1074 |
![]() |
Hersteller: Molex
Description: Conn 0.635 BtB Hsg Cover Assy Em
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 100
Pitch: 0.025" (0.64mm)
Height Above Board: 0.276" (7.01mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 8mm, 14mm
Number of Rows: 2
Description: Conn 0.635 BtB Hsg Cover Assy Em
Features: Board Guide, Solder Retention
Packaging: Tape & Reel (TR)
Connector Type: Plug, Outer Shroud Contacts
Contact Finish: Gold
Mounting Type: Surface Mount
Number of Positions: 100
Pitch: 0.025" (0.64mm)
Height Above Board: 0.276" (7.01mm)
Contact Finish Thickness: 10.0µin (0.25µm)
Mated Stacking Heights: 8mm, 14mm
Number of Rows: 2
auf Bestellung 2520 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 840+ | 7.63 EUR |
| 2520+ | 6.95 EUR |
| 53647-1074 |
![]() |
Hersteller: Molex
Board to Board & Mezzanine Connectors 0.635 BtB Hsg Cover Assy EmbsTpPkg100Ckt
Board to Board & Mezzanine Connectors 0.635 BtB Hsg Cover Assy EmbsTpPkg100Ckt
auf Bestellung 1963 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 11.29 EUR |
| 10+ | 10.12 EUR |
| 25+ | 9.65 EUR |
| 50+ | 9.26 EUR |
| 100+ | 8.85 EUR |
| 250+ | 8.46 EUR |
| 500+ | 8.43 EUR |



