54112-109081700LF Amphenol Communications Solutions-FCI
Hersteller: Amphenol Communications Solutions-FCI
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
Produktrezensionen
Produktbewertung abgeben
Technische Details 54112-109081700LF Amphenol Communications Solutions-FCI
Description: CONN HDR 8POS 0.1" STACK T/H, Number of Rows: 2, Part Status: Active, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Contact Finish - Post (Mating): Gold, GXT™, Termination: Solder, Row Spacing: 0.100" (2.54mm), Packaging: Bulk, Length - Tail: 0.095" (2.413mm), Length - Stack Height: 0.669" (17.000mm), Length - Post (Mating): 0.261" (6.629mm), Length - Overall Pin: 1.025" (26.035mm), Number of Positions: 8, Pitch: 0.100" (2.54mm), Mounting Type: Through Hole, Color: Black.
Weitere Produktangebote 54112-109081700LF nach Preis ab 0.73 EUR bis 0.73 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||
|---|---|---|---|---|---|---|---|
|
|
54112-109081700LF | Amphenol Communications Solutions-FCI |
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch |
auf Bestellung 293 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 54112-109081700LF |
|
Hersteller: Amphenol Communications Solutions-FCI
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 8 Positions, 2.54mm (0.100in) Pitch
auf Bestellung 293 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 241+ | 0.73 EUR |