54112-111262300LF

54112-111262300LF Amphenol Communications Solutions-FCI


54112.pdf Hersteller: Amphenol Communications Solutions-FCI
BergStik®, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch
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Technische Details 54112-111262300LF Amphenol Communications Solutions-FCI

Description: CONN HDR 26POS 0.100" STACK T/H, Packaging: Bag, Color: Black, Mounting Type: Through Hole, Pitch: 0.100" (2.54mm), Row Spacing: 0.100" (2.54mm), Termination: Solder, Contact Finish - Post (Mating): Gold, GXT™, Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm), Number of Rows: 2, Number of Positions: 26, Length - Overall Pin: 1.225" (31.115mm), Length - Post (Mating): 0.225" (5.715mm), Length - Stack Height: 0.906" (23.000mm), Length - Tail: 0.095" (2.413mm).

Weitere Produktangebote 54112-111262300LF

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54112-111262300LF Hersteller : Amphenol ICC (FCI) bwb_bergstik.pdf Description: CONN HDR 26POS 0.100" STACK T/H
Packaging: Bag
Color: Black
Mounting Type: Through Hole
Pitch: 0.100" (2.54mm)
Row Spacing: 0.100" (2.54mm)
Termination: Solder
Contact Finish - Post (Mating): Gold, GXT™
Contact Finish Thickness - Post (Mating): 30.0µin (0.76µm)
Number of Rows: 2
Number of Positions: 26
Length - Overall Pin: 1.225" (31.115mm)
Length - Post (Mating): 0.225" (5.715mm)
Length - Stack Height: 0.906" (23.000mm)
Length - Tail: 0.095" (2.413mm)
Produkt ist nicht verfügbar
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54112-111262300LF 54112-111262300LF Hersteller : Amphenol FCI bwb_bergstik.pdf Headers & Wire Housings BergStik, Board to Board connector, Unshrouded vertical stacked header, Through Hole, Double Row, 26 Positions, 2.54mm (0.100in) Pitch.
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH