54202-S0803LF Amphenol Communications Solutions-FCI
Hersteller: Amphenol Communications Solutions-FCIBergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch
auf Bestellung 2039 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Preis |
|---|---|
| 367+ | 0.40 EUR |
| 419+ | 0.34 EUR |
| 422+ | 0.33 EUR |
| 443+ | 0.30 EUR |
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Produktbewertung abgeben
Technische Details 54202-S0803LF Amphenol Communications Solutions-FCI
Description: CONN HEADER SMD 6POS 2.54MM, Packaging: Bag, Connector Type: Header, Current Rating (Amps): 3A, Mounting Type: Surface Mount, Number of Positions: 6, Number of Rows: 2, Style: Board to Board, Operating Temperature: -65°C ~ 130°C, Contact Type: Male Pin, Fastening Type: Push-Pull, Number of Positions Loaded: All, Termination: Solder, Material Flammability Rating: UL94 V-0, Contact Material: Phosphor Bronze, Insulation Color: Black, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold or Gold, GXT™, Contact Finish Thickness - Mating: 15.0µin (0.38µm), Contact Finish - Post: Tin, Part Status: Active, Contact Shape: Square, Insulation Height: 0.100" (2.54mm), Shrouding: Unshrouded, Row Spacing - Mating: 0.100" (2.54mm), Contact Length - Mating: 0.230" (5.84mm).
Weitere Produktangebote 54202-S0803LF nach Preis ab 0.34 EUR bis 0.81 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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54202-S0803LF | Hersteller : Amphenol FCI |
Headers & Wire Housings 6P UNSHRD VERT HDR .38 MICROMETER AU |
auf Bestellung 4193 Stücke: Lieferzeit 10-14 Tag (e) |
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54202-S0803LF | Hersteller : Amphenol ICC (FCI) |
Description: CONN HEADER SMD 6POS 2.54MM Packaging: Bag Connector Type: Header Current Rating (Amps): 3A Mounting Type: Surface Mount Number of Positions: 6 Number of Rows: 2 Style: Board to Board Operating Temperature: -65°C ~ 130°C Contact Type: Male Pin Fastening Type: Push-Pull Number of Positions Loaded: All Termination: Solder Material Flammability Rating: UL94 V-0 Contact Material: Phosphor Bronze Insulation Color: Black Pitch - Mating: 0.100" (2.54mm) Contact Finish - Mating: Gold or Gold, GXT™ Contact Finish Thickness - Mating: 15.0µin (0.38µm) Contact Finish - Post: Tin Part Status: Active Contact Shape: Square Insulation Height: 0.100" (2.54mm) Shrouding: Unshrouded Row Spacing - Mating: 0.100" (2.54mm) Contact Length - Mating: 0.230" (5.84mm) |
auf Bestellung 9300 Stücke: Lieferzeit 10-14 Tag (e) |
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| 54202-S0803LF | Hersteller : Burndy |
Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Top Entry SMD Bag |
auf Bestellung 2039 Stücke: Lieferzeit 14-21 Tag (e) |
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54202-S0803LF | Hersteller : Amphenol Communications Solutions-FCI |
BergStik®, Board to Board connector, Unshrouded Vertical Header, Surface Mount, Double Row, 6 Positions, 2.54 mm (0.100in) Pitch |
Produkt ist nicht verfügbar |
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54202-S0803LF | Hersteller : FCI |
Conn Unshrouded Header HDR 6 POS 2.54mm Solder ST Top Entry SMD Bag |
Produkt ist nicht verfügbar |