550-10-576M30-001152 Preci-Dip

Description: BGA SOLDER TAIL, Housing Material: FR4 Epoxy Glass, Termination: Solder, Number of Positions or Pins (Grid): 576 (30 x 30), Operating Temperature: -55°C ~ 125°C, Type: BGA, Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.050" (1.27mm), Contact Material - Mating: Brass, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm).