550-10-600M35-001152 Preci-Dip

Description: BGA SOLDER TAIL, Packaging: Bulk, Part Status: Active, Contact Material - Post: Brass, Contact Finish Thickness - Post: 10.0µin (0.25µm), Contact Finish - Post: Gold, Pitch - Post: 0.050" (1.27mm), Contact Material - Mating: Brass, Contact Finish Thickness - Mating: 10.0µin (0.25µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Housing Material: FR4 Epoxy Glass, Termination: Solder, Number of Positions or Pins (Grid): 600 (35 x 35), Operating Temperature: -55°C ~ 125°C, Type: BGA, Mounting Type: Through Hole, Features: Closed Frame.