5600200821 Molex
| Anzahl | Privatkunde |
|---|---|
| 650+ | 0.99 EUR |
| 1300+ | 0.94 EUR |
| 1950+ | 0.9 EUR |
| 2600+ | 0.8 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 5600200821 Molex
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP, Insulation Material: Polyamide (PA), Nylon, Shrouding: Shrouded - 4 Wall, Insulation Height: 0.315" (8.00mm), Contact Shape: Square, Part Status: Active, Contact Finish - Post: Tin, Contact Finish - Mating: Tin, Pitch - Mating: 0.079" (2.00mm), Insulation Color: Black, Contact Material: Copper Alloy, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Latch Lock, Contact Type: Male Pin, Operating Temperature: -40°C ~ 105°C, Style: Board to Cable/Wire, Number of Rows: 1, Number of Positions: 8, Mounting Type: Surface Mount, Current Rating (Amps): Varies by Wire Gauge, Voltage Rating: 150VAC/DC, Connector Type: Header, Features: Solder Retention, Packaging: Tape & Reel (TR).
Weitere Produktangebote 5600200821 nach Preis ab 1.07 EUR bis 2.26 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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5600200821 | Molex |
 Description: 2.0 W/B SMT ST 8CKT EMBOSSED TPInsulation Material: Polyamide (PA), Nylon Shrouding: Shrouded - 4 Wall Insulation Height: 0.315" (8.00mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish - Mating: Tin Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Contact Material: Copper Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Lock Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 150VAC/DC Connector Type: Header Features: Solder Retention Packaging: Tape & Reel (TR) |
auf Bestellung 6500 Stücke: Lieferzeit 10-14 Tag (e) |
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5600200821 | Molex |
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP Insulation Material: Polyamide (PA), Nylon Shrouding: Shrouded - 4 Wall Insulation Height: 0.315" (8.00mm) Contact Shape: Square Part Status: Active Contact Finish - Post: Tin Contact Finish - Mating: Tin Pitch - Mating: 0.079" (2.00mm) Insulation Color: Black Contact Material: Copper Alloy Material Flammability Rating: UL94 V-0 Termination: Solder Number of Positions Loaded: All Fastening Type: Latch Lock Contact Type: Male Pin Operating Temperature: -40°C ~ 105°C Style: Board to Cable/Wire Number of Rows: 1 Number of Positions: 8 Mounting Type: Surface Mount Current Rating (Amps): Varies by Wire Gauge Voltage Rating: 150VAC/DC Connector Type: Header Features: Solder Retention Packaging: Cut Tape (CT) |
auf Bestellung 7057 Stücke: Lieferzeit 10-14 Tag (e) |
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560020-0821 | Molex | Headers & Wire Housings WTB Header SR Vert. 9 Crcts Tin Plating NAT |
auf Bestellung 4625 Stücke: Lieferzeit 10-14 Tag (e) |
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560020-0821 | MOLEX |
Description: MOLEX - 560020-0821 - Stiftleiste, Wire-to-Board, 2 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade tariffCode: 85366930 euEccn: NLR rohsCompliant: YES Kontaktüberzug: Verzinnte Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Kupferlegierung isCanonical: Y Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 8Kontakt(e) SVHC: No SVHC (25-Jun-2025) Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: DuraClik 560020 productTraceability: No Kontaktanschluss: Oberflächenmontage, gerade usEccn: EAR99 Anzahl der Reihen: 1Reihe(n) Rastermaß: 2mm |
auf Bestellung 860 Stücke: Lieferzeit 14-21 Tag (e) |
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| 5600200821 |
|
Hersteller: Molex
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.315" (8.00mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 150VAC/DC
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.315" (8.00mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 150VAC/DC
Connector Type: Header
Features: Solder Retention
Packaging: Tape & Reel (TR)
auf Bestellung 6500 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 650+ | 1.5 EUR |
| 1300+ | 1.43 EUR |
| 1950+ | 1.38 EUR |
| 3250+ | 1.33 EUR |
| 4550+ | 1.31 EUR |
| 6500+ | 1.27 EUR |
| 5600200821 |
|
Hersteller: Molex
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.315" (8.00mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 150VAC/DC
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
Description: 2.0 W/B SMT ST 8CKT EMBOSSED TP
Insulation Material: Polyamide (PA), Nylon
Shrouding: Shrouded - 4 Wall
Insulation Height: 0.315" (8.00mm)
Contact Shape: Square
Part Status: Active
Contact Finish - Post: Tin
Contact Finish - Mating: Tin
Pitch - Mating: 0.079" (2.00mm)
Insulation Color: Black
Contact Material: Copper Alloy
Material Flammability Rating: UL94 V-0
Termination: Solder
Number of Positions Loaded: All
Fastening Type: Latch Lock
Contact Type: Male Pin
Operating Temperature: -40°C ~ 105°C
Style: Board to Cable/Wire
Number of Rows: 1
Number of Positions: 8
Mounting Type: Surface Mount
Current Rating (Amps): Varies by Wire Gauge
Voltage Rating: 150VAC/DC
Connector Type: Header
Features: Solder Retention
Packaging: Cut Tape (CT)
auf Bestellung 7057 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 12+ | 1.88 EUR |
| 14+ | 1.59 EUR |
| 25+ | 1.5 EUR |
| 50+ | 1.43 EUR |
| 100+ | 1.36 EUR |
| 250+ | 1.27 EUR |
| 560020-0821 |
Hersteller: Molex
Headers & Wire Housings WTB Header SR Vert. 9 Crcts Tin Plating NAT
Headers & Wire Housings WTB Header SR Vert. 9 Crcts Tin Plating NAT
auf Bestellung 4625 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 2.09 EUR |
| 10+ | 1.76 EUR |
| 25+ | 1.69 EUR |
| 100+ | 1.58 EUR |
| 250+ | 1.44 EUR |
| 650+ | 1.17 EUR |
| 1300+ | 1.07 EUR |
| 560020-0821 |
Hersteller: MOLEX
Description: MOLEX - 560020-0821 - Stiftleiste, Wire-to-Board, 2 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (25-Jun-2025)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: DuraClik 560020
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 2mm
Description: MOLEX - 560020-0821 - Stiftleiste, Wire-to-Board, 2 mm, 1 Reihe(n), 8 Kontakt(e), Oberflächenmontage, gerade
tariffCode: 85366930
euEccn: NLR
rohsCompliant: YES
Kontaktüberzug: Verzinnte Kontakte
hazardous: false
rohsPhthalatesCompliant: YES
Kontaktmaterial: Kupferlegierung
isCanonical: Y
Steckverbinderkragen: Mit Kragen
Anzahl der Kontakte: 8Kontakt(e)
SVHC: No SVHC (25-Jun-2025)
Steckverbindersysteme: Wire-to-Board
Steckverbinder: PCB-Stiftleiste
Produktpalette: DuraClik 560020
productTraceability: No
Kontaktanschluss: Oberflächenmontage, gerade
usEccn: EAR99
Anzahl der Reihen: 1Reihe(n)
Rastermaß: 2mm
auf Bestellung 860 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 111+ | 2.26 EUR |
| 140+ | 1.67 EUR |
| 500+ | 1.44 EUR |