Technische Details 566010B03400G Boyd Corporation
Description: HEATSINK W/TAB BLACK, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.500" (12.70mm), Thermal Resistance @ Natural: 11.50°C/W, Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM, Power Dissipation @ Temperature Rise: 2.0W @ 30°C, Attachment Method: Clip and PC Pin, Package Cooled: Multiwatt, SIP, Width: 1.000" (25.40mm), Type: Board Level, Vertical, Shape: Rectangular, Fins, Length: 1.220" (30.99mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote 566010B03400G nach Preis ab 11.59 EUR bis 16.54 EUR
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566010B03400G | Boyd Laconia, LLC |
 Description: HEATSINK W/TAB BLACKPart Status: Active Material Finish: Black Anodized Fin Height: 0.500" (12.70mm) Thermal Resistance @ Natural: 11.50°C/W Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM Power Dissipation @ Temperature Rise: 2.0W @ 30°C Attachment Method: Clip and PC Pin Package Cooled: Multiwatt, SIP Width: 1.000" (25.40mm) Type: Board Level, Vertical Shape: Rectangular, Fins Length: 1.220" (30.99mm) Material: Aluminum Packaging: Bulk |
auf Bestellung 1574 Stücke: Lieferzeit 10-14 Tag (e) |
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566010B03400G | Boyd Corporation |
Heat Sink Passive SIP Thru-Hole Aluminum 11.5°C/W Black Anodized |
auf Bestellung 10 Stücke: Lieferzeit 14-21 Tag (e) |
Im Einkaufswagen Stück im Wert von UAH |
| 566010B03400G |
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Hersteller: Boyd Laconia, LLC
Description: HEATSINK W/TAB BLACK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK W/TAB BLACK
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.500" (12.70mm)
Thermal Resistance @ Natural: 11.50°C/W
Thermal Resistance @ Forced Air Flow: 4.00°C/W @ 300 LFM
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Attachment Method: Clip and PC Pin
Package Cooled: Multiwatt, SIP
Width: 1.000" (25.40mm)
Type: Board Level, Vertical
Shape: Rectangular, Fins
Length: 1.220" (30.99mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 1574 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 2+ | 16.54 EUR |
| 10+ | 14.64 EUR |
| 25+ | 13.95 EUR |
| 50+ | 13.44 EUR |
| 100+ | 12.96 EUR |
| 250+ | 12.34 EUR |
| 800+ | 11.59 EUR |
| 566010B03400G |
|
Hersteller: Boyd Corporation
Heat Sink Passive SIP Thru-Hole Aluminum 11.5°C/W Black Anodized
Heat Sink Passive SIP Thru-Hole Aluminum 11.5°C/W Black Anodized
auf Bestellung 10 Stücke:
Lieferzeit 14-21 Tag (e)