
5767081-6 TE Connectivity / AMP

Board to Board & Mezzanine Connectors MICT REC 228 ASY PDNI BARBLESS
auf Bestellung 4 Stücke:
Lieferzeit 10-14 Tag (e)
Anzahl | Preis |
---|---|
1+ | 173.62 EUR |
12+ | 156.85 EUR |
30+ | 151.04 EUR |
54+ | 146.20 EUR |
102+ | 138.46 EUR |
252+ | 135.91 EUR |
504+ | 134.29 EUR |
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Technische Details 5767081-6 TE Connectivity / AMP
Description: CONN RCPT 228P SMD PALLAD-NICKEL, Features: Board Guide, Ground Bus (Plane), Packaging: Tube, Connector Type: Receptacle, Center Strip Contacts, Contact Finish: Palladium-Nickel, Mounting Type: Surface Mount, Number of Positions: 228, Pitch: 0.025" (0.64mm), Height Above Board: 0.236" (6.00mm), Contact Finish Thickness: 5.00µin (0.127µm), Mated Stacking Heights: 6.6mm, 9mm, 10.92mm, 12.57mm, 17.96mm, 18.75mm, 20mm, 22.86mm, Part Status: Active, Number of Rows: 2.
Weitere Produktangebote 5767081-6 nach Preis ab 182.28 EUR bis 182.28 EUR
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5767081-6 | Hersteller : TE Connectivity AMP Connectors |
![]() Features: Board Guide, Ground Bus (Plane) Packaging: Tube Connector Type: Receptacle, Center Strip Contacts Contact Finish: Palladium-Nickel Mounting Type: Surface Mount Number of Positions: 228 Pitch: 0.025" (0.64mm) Height Above Board: 0.236" (6.00mm) Contact Finish Thickness: 5.00µin (0.127µm) Mated Stacking Heights: 6.6mm, 9mm, 10.92mm, 12.57mm, 17.96mm, 18.75mm, 20mm, 22.86mm Part Status: Active Number of Rows: 2 |
auf Bestellung 5 Stücke: Lieferzeit 10-14 Tag (e) |
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