6-104549-1 TE Connectivity / AMP
Hersteller: TE Connectivity / AMP
Board to Board & Mezzanine Connectors 12 SYS50 S/M HDR DRST SHRDSN
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Technische Details 6-104549-1 TE Connectivity / AMP
Description: CONN HEADER SMD 12POS 1.27MM, Insulation Color: Black, Contact Material: Copper Alloy, Material Flammability Rating: UL94 V-0, Termination: Solder, Number of Positions Loaded: All, Fastening Type: Latch Holder, Contact Type: Male Pin, Operating Temperature: -65°C ~ 105°C, Style: Board to Board or Cable, Number of Rows: 2, Number of Positions: 12, Mounting Type: Surface Mount, Voltage Rating: 30VAC, Connector Type: Header, Contact Length - Mating: 0.125" (3.18mm), Row Spacing - Mating: 0.100" (2.54mm), Insulation Material: Polyphthalamide (PPA), Shrouding: Shrouded - 4 Wall, Insulation Height: 0.435" (11.05mm), Contact Shape: Circular, Part Status: Active, Contact Finish - Post: Tin, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.050" (1.27mm), Features: Board Lock, Packaging: Tube.
Weitere Produktangebote 6-104549-1
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6-104549-1 | Hersteller : TE CONNECTIVITY / PARTNER STOCK |
Description: TE CONNECTIVITY / PARTNER STOCK - 6-104549-1 - Stiftleiste, Wire-to-Board, 1.27 mm, 2 Reihe(n), 12 Kontakt(e), Durchsteckmontage, geradetariffCode: 85366990 rohsCompliant: YES Kontaktüberzug: Vergoldete Kontakte hazardous: false rohsPhthalatesCompliant: YES Kontaktmaterial: Phosphorbronze isCanonical: Y usEccn: EAR99 Steckverbinderkragen: Mit Kragen Anzahl der Kontakte: 12Kontakt(e) euEccn: NLR Steckverbindersysteme: Wire-to-Board Steckverbinder: PCB-Stiftleiste Produktpalette: AMPMODU System 50 productTraceability: No Kontaktanschluss: Durchsteckmontage, gerade Anzahl der Reihen: 2Reihe(n) Rastermaß: 1.27mm SVHC: No SVHC (21-Jan-2025) |
auf Bestellung 1102 Stücke: Lieferzeit 14-21 Tag (e) |

