614-43-316-31-012000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD
Termination: Solder
Number of Positions or Pins (Grid): 16 (2 x 8)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.3" (7.62mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
| Anzahl | Preis |
|---|---|
| 3+ | 7.37 EUR |
| 10+ | 6.27 EUR |
| 25+ | 5.87 EUR |
| 50+ | 5.59 EUR |
| 100+ | 5.33 EUR |
| 250+ | 4.99 EUR |
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Technische Details 614-43-316-31-012000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 16POS GOLD, Termination: Solder, Number of Positions or Pins (Grid): 16 (2 x 8), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.3" (7.62mm) Row Spacing, Mounting Type: Through Hole, Features: Carrier, Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester.
Weitere Produktangebote 614-43-316-31-012000 nach Preis ab 5.49 EUR bis 8.29 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
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Preis | ||||||||||||||||
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| 614-43-316-31-012000 | Hersteller : Mill-Max |
IC & Component Sockets 16 PIN CARRIER |
auf Bestellung 11 Stücke: Lieferzeit 10-14 Tag (e) |
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