614-93-640-31-012000 Mill-Max Manufacturing Corp.
Hersteller: Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 40 (2 x 20)
Operating Temperature: -55°C ~ 125°C
Type: DIP, 0.6" (15.24mm) Row Spacing
Mounting Type: Through Hole
Features: Carrier, Open Frame
Packaging: Tube
Part Status: Active
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 200.0µin (5.08µm)
Contact Finish - Post: Tin-Lead
Pitch - Post: 0.100" (2.54mm)
| Anzahl | Preis |
|---|---|
| 2+ | 16.61 EUR |
| 10+ | 14.12 EUR |
| 30+ | 13.07 EUR |
| 50+ | 12.61 EUR |
| 100+ | 12 EUR |
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Technische Details 614-93-640-31-012000 Mill-Max Manufacturing Corp.
Description: CONN IC DIP SOCKET 40POS GOLD, Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 40 (2 x 20), Operating Temperature: -55°C ~ 125°C, Type: DIP, 0.6" (15.24mm) Row Spacing, Mounting Type: Through Hole, Features: Carrier, Open Frame, Packaging: Tube, Part Status: Active, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 200.0µin (5.08µm), Contact Finish - Post: Tin-Lead, Pitch - Post: 0.100" (2.54mm).
Weitere Produktangebote 614-93-640-31-012000
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
Preis |
|---|---|---|---|---|---|
| 614-93-640-31-012000 | Hersteller : Mill-Max |
IC & Component Sockets 40 PIN CARRIER |
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