624-25ABT4E Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 21MM SQ W/DBL TAPE
Packaging: Bulk
Material: Aluminum
Length: 0.827" (21.00mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 0.827" (21.00mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
| Anzahl | Preis |
|---|---|
| 7+ | 2.9 EUR |
| 10+ | 2.57 EUR |
| 25+ | 2.44 EUR |
| 50+ | 2.36 EUR |
| 100+ | 2.27 EUR |
| 250+ | 2.16 EUR |
| 500+ | 2.09 EUR |
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Technische Details 624-25ABT4E Wakefield Thermal Solutions
Description: HEATSINK CPU 21MM SQ W/DBL TAPE, Packaging: Bulk, Material: Aluminum, Length: 0.827" (21.00mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 0.827" (21.00mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Thermal Resistance @ Forced Air Flow: 25.00°C/W @ 200 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote 624-25ABT4E nach Preis ab 3.4 EUR bis 4.12 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung |
Verfügbarkeit |
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624-25ABT4E | Hersteller : Wakefield-Vette |
Heat Sinks Omnidirectional Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 6.4mm, T410R |
auf Bestellung 3603 Stücke: Lieferzeit 10-14 Tag (e) |
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624-25ABT4E | Hersteller : Wakefield Thermal |
Heat Sinks Omnidirectional Heat Sink for 21mm BGA/Super BGA/PBGA/FPBGA, 6.4mm, T410R |
Produkt ist nicht verfügbar |
