63MF333KZ12012 Rubycon
Hersteller: RubyconDescription: CAP FILM .033UF 10% 63VDC 0805
Tolerance: ±10%
Features: High Temperature
Packaging: Cut Tape (CT)
Package / Case: 0805 (2012 Metric)
Mounting Type: Surface Mount
Operating Temperature: -55°C ~ 125°C
Applications: General Purpose
Termination: Solder Pads
Dielectric Material: Polymer, Metallized
Voltage Rating - DC: 25V
Height - Seated (Max): 0.039" (1.00mm)
Capacitance: 0.033 µF
Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm)
auf Bestellung 2996 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 3.84 EUR |
| 10+ | 2.64 EUR |
| 50+ | 2.16 EUR |
| 100+ | 2.01 EUR |
| 500+ | 1.77 EUR |
| 1000+ | 1.71 EUR |
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Technische Details 63MF333KZ12012 Rubycon
Description: CAP FILM .033UF 10% 63VDC 0805, Tolerance: ±10%, Features: High Temperature, Packaging: Tape & Reel (TR), Package / Case: 0805 (2012 Metric), Mounting Type: Surface Mount, Operating Temperature: -55°C ~ 125°C, Applications: General Purpose, Termination: Solder Pads, Dielectric Material: Polymer, Metallized, Voltage Rating - DC: 25V, Height - Seated (Max): 0.039" (1.00mm), Capacitance: 0.033 µF, Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm).
Weitere Produktangebote 63MF333KZ12012
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63MF333KZ12012 | Hersteller : Rubycon |
Description: CAP FILM .033UF 10% 63VDC 0805 Tolerance: ±10% Features: High Temperature Packaging: Tape & Reel (TR) Package / Case: 0805 (2012 Metric) Mounting Type: Surface Mount Operating Temperature: -55°C ~ 125°C Applications: General Purpose Termination: Solder Pads Dielectric Material: Polymer, Metallized Voltage Rating - DC: 25V Height - Seated (Max): 0.039" (1.00mm) Capacitance: 0.033 µF Size / Dimension: 0.079" L x 0.049" W (2.00mm x 1.25mm) |
auf Bestellung 2996 Stücke: Lieferzeit 10-14 Tag (e) |