655-26AB Wakefield-Vette
Hersteller: Wakefield-Vette
Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x6.6mm
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.49 EUR |
| 10+ | 4.36 EUR |
| 25+ | 4.25 EUR |
| 100+ | 2.93 EUR |
| 500+ | 2.92 EUR |
Produktrezensionen
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Technische Details 655-26AB Wakefield-Vette
Description: HEATSINK FOR 40MM BGA, Packaging: Bulk, Material: Aluminum, Length: 1.600" (40.64mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.600" (40.64mm), Package Cooled: Assorted (BGA, LGA, CPU, ASIC...), Attachment Method: Thermal Tape, Adhesive (Not Included), Power Dissipation @ Temperature Rise: 5.0W @ 60°C, Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM, Fin Height: 0.260" (6.60mm), Material Finish: Black Anodized.
Weitere Produktangebote 655-26AB nach Preis ab 2.48 EUR bis 4.8 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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655-26AB | Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x6.6mm |
auf Bestellung 633 Stücke: Lieferzeit 10-14 Tag (e) |
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| 655-26AB | Wakefield-Vette, Inc |
Heat Sink Passive BGA Pin Array Black Anodized |
auf Bestellung 1500 Stücke: Lieferzeit 14-21 Tag (e) |
|
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| 655-26AB | Wakefield-Vette |
Description: HEATSINK FOR 40MM BGAPackaging: Bulk Material: Aluminum Length: 1.600" (40.64mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.600" (40.64mm) Package Cooled: Assorted (BGA, LGA, CPU, ASIC...) Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 5.0W @ 60°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM Fin Height: 0.260" (6.60mm) Material Finish: Black Anodized |
auf Bestellung 3936 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 655-26AB |
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Hersteller: Wakefield Thermal
Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x6.6mm
Heat Sinks Omnidirectional Pin Fin Heat Sink for 40mm BGA and PowerPC, 40.6x6.6mm
auf Bestellung 633 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 4.8 EUR |
| 10+ | 3.19 EUR |
| 500+ | 3.08 EUR |
| 1000+ | 3.03 EUR |
| 655-26AB |
![]() |
Hersteller: Wakefield-Vette, Inc
Heat Sink Passive BGA Pin Array Black Anodized
Heat Sink Passive BGA Pin Array Black Anodized
auf Bestellung 1500 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 52+ | 3.39 EUR |
| 100+ | 2.94 EUR |
| 250+ | 2.76 EUR |
| 500+ | 2.62 EUR |
| 1000+ | 2.48 EUR |
| 655-26AB |
![]() |
Hersteller: Wakefield-Vette
Description: HEATSINK FOR 40MM BGA
Packaging: Bulk
Material: Aluminum
Length: 1.600" (40.64mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.600" (40.64mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 5.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM
Fin Height: 0.260" (6.60mm)
Material Finish: Black Anodized
Description: HEATSINK FOR 40MM BGA
Packaging: Bulk
Material: Aluminum
Length: 1.600" (40.64mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.600" (40.64mm)
Package Cooled: Assorted (BGA, LGA, CPU, ASIC...)
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 5.0W @ 60°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 500 LFM
Fin Height: 0.260" (6.60mm)
Material Finish: Black Anodized
auf Bestellung 3936 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.69 EUR |
| 10+ | 3.26 EUR |
| 25+ | 3.11 EUR |
| 50+ | 2.99 EUR |
| 100+ | 2.88 EUR |
| 250+ | 2.78 EUR |

