658-25ABT4E Wakefield Thermal Solutions
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Adhesive
Power Dissipation @ Temperature Rise: 2.0W @ 40°C
Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM
Fin Height: 0.250" (6.35mm)
Material Finish: Black Anodized
| Anzahl | Preis |
|---|---|
| 5+ | 4.12 EUR |
| 10+ | 3.64 EUR |
| 25+ | 3.47 EUR |
| 50+ | 3.34 EUR |
| 100+ | 3.22 EUR |
| 250+ | 3.07 EUR |
| 500+ | 2.96 EUR |
| 1400+ | 2.8 EUR |
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Technische Details 658-25ABT4E Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQ BLK W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Adhesive, Power Dissipation @ Temperature Rise: 2.0W @ 40°C, Thermal Resistance @ Forced Air Flow: 5.00°C/W @ 500 LFM, Fin Height: 0.250" (6.35mm), Material Finish: Black Anodized.
Weitere Produktangebote 658-25ABT4E nach Preis ab 3.4 EUR bis 5.98 EUR
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