658-45AB Wakefield Thermal
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 11.4mm
Material: aluminium
Material finishing: anodized
Base thickness: 2mm
Manufacturer series: 658
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Technische Details 658-45AB Wakefield Thermal
Description: HEATSINK CPU 28MM SQBLK W/O TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Fin Height: 0.450" (11.43mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 658-45AB nach Preis ab 1.45 EUR bis 3.43 EUR
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658-45AB | Wakefield-Vette |
Heat Sinks The factory is currently not accepting orders for this product. |
auf Bestellung 3025 Stücke: Lieferzeit 10-14 Tag (e) |
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658-45AB | Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum |
auf Bestellung 2375 Stücke: Lieferzeit 10-14 Tag (e) |
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658-45AB | Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQBLK W/O TAPE Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Fin Height: 0.450" (11.43mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1465 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 658-45AB |
|
Hersteller: Wakefield-Vette
Heat Sinks The factory is currently not accepting orders for this product.
Heat Sinks The factory is currently not accepting orders for this product.
auf Bestellung 3025 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.08 EUR |
| 10+ | 1.88 EUR |
| 100+ | 1.76 EUR |
| 250+ | 1.66 EUR |
| 500+ | 1.56 EUR |
| 1000+ | 1.45 EUR |
| 658-45AB |
|
Hersteller: Wakefield Thermal
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum
auf Bestellung 2375 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 2+ | 2.73 EUR |
| 10+ | 2.59 EUR |
| 25+ | 2.55 EUR |
| 50+ | 2.52 EUR |
| 1000+ | 2.5 EUR |
| 658-45AB |
|
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQBLK W/O TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Fin Height: 0.450" (11.43mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK CPU 28MM SQBLK W/O TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Not Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Fin Height: 0.450" (11.43mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1465 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 6+ | 3.43 EUR |
| 10+ | 3.04 EUR |
| 25+ | 2.89 EUR |
| 50+ | 2.79 EUR |
| 100+ | 2.69 EUR |
| 250+ | 2.56 EUR |
| 500+ | 2.47 EUR |
| 1000+ | 2.38 EUR |