658-45AB Wakefield Thermal
Hersteller: Wakefield Thermal
Category: Heatsinks
Description: Heatsink: extruded; grilled; BGA; black; L: 27.9mm; W: 27.9mm; 658
Type of heatsink: extruded
Heatsink shape: grilled
Application: BGA
Colour: black
Length: 27.9mm
Width: 27.9mm
Height: 11.4mm
Material: aluminium
Material finishing: anodized
Base thickness: 2mm
Manufacturer series: 658
| Anzahl | Preis |
|---|---|
| 59+ | 1.23 EUR |
| 61+ | 1.19 EUR |
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Technische Details 658-45AB Wakefield Thermal
Description: HEATSINK CPU 28MM SQBLK W/O TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Not Included), Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Fin Height: 0.450" (11.43mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 658-45AB nach Preis ab 1.45 EUR bis 3.43 EUR
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658-45AB | Hersteller : Wakefield-Vette |
Heat Sinks The factory is currently not accepting orders for this product. |
auf Bestellung 3025 Stücke: Lieferzeit 10-14 Tag (e) |
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658-45AB | Hersteller : Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA and PowerPC, Aluminum |
auf Bestellung 2375 Stücke: Lieferzeit 10-14 Tag (e) |
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658-45AB | Hersteller : Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQBLK W/O TAPE Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Not Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Fin Height: 0.450" (11.43mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1465 Stücke: Lieferzeit 10-14 Tag (e) |
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