658-45ABT3 Wakefield-Vette
Hersteller: Wakefield-Vette
Heat Sinks The factory is currently not accepting orders for this product.
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.55 EUR |
| 10+ | 5.4 EUR |
| 25+ | 5.07 EUR |
| 100+ | 4.66 EUR |
| 250+ | 4.38 EUR |
| 500+ | 4.24 EUR |
Artikel auf Bestellung
Nicht an unserem Lager — wir beziehen ihn nach Ihrer Bestellung vom Lieferantenlager.
Lieferzeit:
10-14 Tag (e)
Produktrezensionen
Produktbewertung abgeben
Technische Details 658-45ABT3 Wakefield-Vette
Description: HEATSINK CPU 28MM SQ BLK W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Fin Height: 0.450" (11.43mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 658-45ABT3 nach Preis ab 3.7 EUR bis 6.95 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
658-45ABT3 | Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQ BLK W/TAPE Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 3.0W @ 50°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Fin Height: 0.450" (11.43mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 22853 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
| 658-45ABT3 | Wakefield-Vette, Inc |
Heat Sink Passive BGA Pin Array Adhesive Black Anodized |
auf Bestellung 4740 Stücke: Lieferzeit 14-21 Tag (e) |
|
| 658-45ABT3 |
|
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Fin Height: 0.450" (11.43mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Fin Height: 0.450" (11.43mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 22853 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.95 EUR |
| 10+ | 6.16 EUR |
| 25+ | 5.88 EUR |
| 50+ | 5.66 EUR |
| 100+ | 5.45 EUR |
| 250+ | 5.2 EUR |
| 500+ | 5.01 EUR |
| 1000+ | 4.83 EUR |
| 658-45ABT3 |
|
Hersteller: Wakefield-Vette, Inc
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
auf Bestellung 4740 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 30+ | 6.08 EUR |
| 100+ | 4.71 EUR |
| 250+ | 4.32 EUR |
| 500+ | 4.05 EUR |
| 1000+ | 3.7 EUR |