658-45ABT3 Wakefield-Vette
Hersteller: Wakefield-Vette
Heat Sinks The factory is currently not accepting orders for this product.
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.55 EUR |
| 10+ | 5.4 EUR |
| 25+ | 5.07 EUR |
| 100+ | 4.66 EUR |
| 250+ | 4.38 EUR |
| 500+ | 4.24 EUR |
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Technische Details 658-45ABT3 Wakefield-Vette
Description: HEATSINK CPU 28MM SQ BLK W/TAPE, Part Status: Active, Material Finish: Black Anodized, Fin Height: 0.450" (11.43mm), Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM, Power Dissipation @ Temperature Rise: 3.0W @ 50°C, Attachment Method: Thermal Tape, Adhesive (Included), Package Cooled: BGA, Width: 1.100" (27.94mm), Type: Top Mount, Shape: Square, Pin Fins, Length: 1.100" (27.94mm), Material: Aluminum, Packaging: Bulk.
Weitere Produktangebote 658-45ABT3 nach Preis ab 3.58 EUR bis 7.1 EUR
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658-45ABT3 | Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQ BLK W/TAPE Part Status: Active Material Finish: Black Anodized Fin Height: 0.450" (11.43mm) Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM Power Dissipation @ Temperature Rise: 3.0W @ 50°C Attachment Method: Thermal Tape, Adhesive (Included) Package Cooled: BGA Width: 1.100" (27.94mm) Type: Top Mount Shape: Square, Pin Fins Length: 1.100" (27.94mm) Material: Aluminum Packaging: Bulk |
auf Bestellung 22913 Stücke: Lieferzeit 10-14 Tag (e) |
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| 658-45ABT3 | Wakefield-Vette, Inc |
Heat Sink Passive BGA Pin Array Adhesive Black Anodized |
auf Bestellung 4740 Stücke: Lieferzeit 14-21 Tag (e) |
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| 658-45ABT3 |
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Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.450" (11.43mm)
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: BGA
Width: 1.100" (27.94mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.100" (27.94mm)
Material: Aluminum
Packaging: Bulk
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Part Status: Active
Material Finish: Black Anodized
Fin Height: 0.450" (11.43mm)
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 200 LFM
Power Dissipation @ Temperature Rise: 3.0W @ 50°C
Attachment Method: Thermal Tape, Adhesive (Included)
Package Cooled: BGA
Width: 1.100" (27.94mm)
Type: Top Mount
Shape: Square, Pin Fins
Length: 1.100" (27.94mm)
Material: Aluminum
Packaging: Bulk
auf Bestellung 22913 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 7.1 EUR |
| 10+ | 6.3 EUR |
| 25+ | 6 EUR |
| 50+ | 5.78 EUR |
| 100+ | 5.57 EUR |
| 250+ | 5.31 EUR |
| 500+ | 5.12 EUR |
| 1000+ | 4.93 EUR |
| 658-45ABT3 |
|
Hersteller: Wakefield-Vette, Inc
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
Heat Sink Passive BGA Pin Array Adhesive Black Anodized
auf Bestellung 4740 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 30+ | 5.88 EUR |
| 100+ | 4.55 EUR |
| 250+ | 4.16 EUR |
| 500+ | 3.92 EUR |
| 1000+ | 3.58 EUR |