658-60ABT3 Wakefield-Vette
Hersteller: Wakefield-Vette
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Aluminum, Chomerics T412
| Anzahl | Privatkunde |
|---|---|
| 1+ | 5.99 EUR |
| 10+ | 5.93 EUR |
| 25+ | 5.65 EUR |
| 100+ | 5.38 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 658-60ABT3 Wakefield-Vette
Description: HEATSINK CPU 28MM SQ BLK W/TAPE, Packaging: Bulk, Material: Aluminum, Length: 1.100" (27.94mm), Shape: Square, Pin Fins, Type: Top Mount, Width: 1.100" (27.94mm), Package Cooled: BGA, Attachment Method: Thermal Tape, Adhesive (Included), Power Dissipation @ Temperature Rise: 2.5W @ 30°C, Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM, Fin Height: 0.598" (15.20mm), Material Finish: Black Anodized, Part Status: Active.
Weitere Produktangebote 658-60ABT3 nach Preis ab 4.22 EUR bis 6.59 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||||
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
658-60ABT3 | Wakefield Thermal Solutions |
Description: HEATSINK CPU 28MM SQ BLK W/TAPE Packaging: Bulk Material: Aluminum Length: 1.100" (27.94mm) Shape: Square, Pin Fins Type: Top Mount Width: 1.100" (27.94mm) Package Cooled: BGA Attachment Method: Thermal Tape, Adhesive (Included) Power Dissipation @ Temperature Rise: 2.5W @ 30°C Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM Fin Height: 0.598" (15.20mm) Material Finish: Black Anodized Part Status: Active |
auf Bestellung 1700 Stücke: Lieferzeit 10-14 Tag (e) |
|
||||||||||||||||
|
|
658-60ABT3 | Wakefield Thermal |
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Aluminum, Chomerics T412 |
auf Bestellung 950 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 658-60ABT3 |
|
Hersteller: Wakefield Thermal Solutions
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
Fin Height: 0.598" (15.20mm)
Material Finish: Black Anodized
Part Status: Active
Description: HEATSINK CPU 28MM SQ BLK W/TAPE
Packaging: Bulk
Material: Aluminum
Length: 1.100" (27.94mm)
Shape: Square, Pin Fins
Type: Top Mount
Width: 1.100" (27.94mm)
Package Cooled: BGA
Attachment Method: Thermal Tape, Adhesive (Included)
Power Dissipation @ Temperature Rise: 2.5W @ 30°C
Thermal Resistance @ Forced Air Flow: 2.00°C/W @ 500 LFM
Fin Height: 0.598" (15.20mm)
Material Finish: Black Anodized
Part Status: Active
auf Bestellung 1700 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 4+ | 6.22 EUR |
| 10+ | 5.5 EUR |
| 25+ | 5.24 EUR |
| 50+ | 5.05 EUR |
| 100+ | 4.87 EUR |
| 250+ | 4.64 EUR |
| 700+ | 4.39 EUR |
| 1400+ | 4.22 EUR |
| 658-60ABT3 |
|
Hersteller: Wakefield Thermal
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Aluminum, Chomerics T412
Heat Sinks Omnidirectional Pin Fin Heat Sink for 27mm BGA/PowerPC, Aluminum, Chomerics T412
auf Bestellung 950 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 6.59 EUR |
| 10+ | 6.18 EUR |
| 25+ | 6.07 EUR |
| 50+ | 5.82 EUR |
| 100+ | 5.74 EUR |
| 250+ | 5.38 EUR |
| 500+ | 5.11 EUR |