66AK2L06XCMS Texas Instruments

Description: IC SOC MULTICORE DSP+ARM 900BGA, Packaging: Tray, Part Status: Active, Supplier Device Package: 900-FCBGA (25x25), Clock Rate: 1GHz, Voltage - Core: Variable, Voltage - I/O: 0.85V, 1.0V, 1.8V, 3.3V, On-Chip RAM: 5.384MB, Non-Volatile Memory: ROM (384kB), Operating Temperature: 0°C ~ 100°C (TC), Type: DSP+ARM®, Interface: EBI/EMI, Ethernet, DMA, I2C, PCIe, SPI, UART/USART, USB 3.0, USIM, Mounting Type: Surface Mount, Package / Case: 900-BFBGA, FCBGA.