68-PLS11033-16 Aries Electronics

Description: CONN SOCKET PGA ZIF GOLD, Part Status: Obsolete, Contact Material - Post: Beryllium Copper, Contact Finish Thickness - Post: 50.0µin (1.27µm), Contact Finish - Post: Nickel Bronze, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polyphenylene Sulfide (PPS), Termination: Solder, Operating Temperature: -65°C ~ 200°C, Type: PGA, ZIF (ZIP), Mounting Type: Through Hole, Features: Closed Frame, Packaging: Bulk.