7109D/TRG BOYD CORP
Hersteller: BOYD CORP
Category: Heatsinks
Description: Heatsink: die-cut; U; TO263; L: 19.38mm; W: 25.4mm; H: 1143mm; copper
Material: copper
Type of heatsink: die-cut
Material finishing: tin plated
Application: TO263
Heatsink shape: U
Height: 1143mm
Width: 25.4mm
Length: 19.38mm
| Anzahl | Privatkunde |
|---|---|
| 9+ | 9.84 EUR |
| 10+ | 9.14 EUR |
| 50+ | 8.68 EUR |
| 125+ | 7.98 EUR |
Produktrezensionen
Produktbewertung abgeben
Technische Details 7109D/TRG BOYD CORP
Description: HEATSINK TO-263 (D2PK), Packaging: Tape & Reel (TR), Material: Copper, Length: 0.763" (19.38mm), Shape: Rectangular, Fins, Type: Top Mount, Width: 1.000" (25.40mm), Package Cooled: TO-263 (D²Pak), Attachment Method: SMD Pad, Power Dissipation @ Temperature Rise: 2.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM, Thermal Resistance @ Natural: 11.00°C/W, Fin Height: 0.450" (11.43mm), Material Finish: Tin, Part Status: Active.
Weitere Produktangebote 7109D/TRG nach Preis ab 2.74 EUR bis 3.97 EUR
| Foto | Bezeichnung | Hersteller | Beschreibung | Verfügbarkeit | Privatkunde | ||||||||||||||
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7109D/TRG | Boyd Laconia, LLC |
Description: HEATSINK TO-263 (D2PK) Packaging: Tape & Reel (TR) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.00°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
auf Bestellung 20000 Stücke: Lieferzeit 10-14 Tag (e) |
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7109D/TRG | Aavid |
Heat Sinks Surface Mount Heat Sink for TO-263, D2PAK, Horizontal, 9 Degree C/W, 25.4mm, T/R |
auf Bestellung 7442 Stücke: Lieferzeit 10-14 Tag (e) |
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7109D/TRG | Boyd Laconia, LLC |
Description: HEATSINK TO-263 (D2PK) Packaging: Cut Tape (CT) Material: Copper Length: 0.763" (19.38mm) Shape: Rectangular, Fins Type: Top Mount Width: 1.000" (25.40mm) Package Cooled: TO-263 (D²Pak) Attachment Method: SMD Pad Power Dissipation @ Temperature Rise: 2.0W @ 30°C Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM Thermal Resistance @ Natural: 11.00°C/W Fin Height: 0.450" (11.43mm) Material Finish: Tin Part Status: Active |
auf Bestellung 20086 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 7109D/TRG |
|
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-263 (D2PK)
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK TO-263 (D2PK)
Packaging: Tape & Reel (TR)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 20000 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 125+ | 3.09 EUR |
| 250+ | 2.98 EUR |
| 375+ | 2.92 EUR |
| 625+ | 2.83 EUR |
| 875+ | 2.78 EUR |
| 1250+ | 2.74 EUR |
| 7109D/TRG |
|
Hersteller: Aavid
Heat Sinks Surface Mount Heat Sink for TO-263, D2PAK, Horizontal, 9 Degree C/W, 25.4mm, T/R
Heat Sinks Surface Mount Heat Sink for TO-263, D2PAK, Horizontal, 9 Degree C/W, 25.4mm, T/R
auf Bestellung 7442 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 1+ | 3.97 EUR |
| 10+ | 3.53 EUR |
| 25+ | 3.36 EUR |
| 50+ | 3.25 EUR |
| 125+ | 3.03 EUR |
| 250+ | 2.89 EUR |
| 500+ | 2.76 EUR |
| 7109D/TRG |
|
Hersteller: Boyd Laconia, LLC
Description: HEATSINK TO-263 (D2PK)
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
Description: HEATSINK TO-263 (D2PK)
Packaging: Cut Tape (CT)
Material: Copper
Length: 0.763" (19.38mm)
Shape: Rectangular, Fins
Type: Top Mount
Width: 1.000" (25.40mm)
Package Cooled: TO-263 (D²Pak)
Attachment Method: SMD Pad
Power Dissipation @ Temperature Rise: 2.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 3.00°C/W @ 300 LFM
Thermal Resistance @ Natural: 11.00°C/W
Fin Height: 0.450" (11.43mm)
Material Finish: Tin
Part Status: Active
auf Bestellung 20086 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 6+ | 3.97 EUR |
| 10+ | 3.53 EUR |
| 25+ | 3.37 EUR |
| 50+ | 3.24 EUR |