Technische Details 7136DG Boyd Corporation
Description: BOARD LEVEL HEATSINK .515"TO-220, Packaging: Bulk, Material: Copper, Length: 0.848" (21.55mm), Shape: Rectangular, Fins, Type: Board Level, Vertical, Width: 0.520" (13.21mm), Package Cooled: TO-220, Attachment Method: Clip and PC Pin, Power Dissipation @ Temperature Rise: 1.0W @ 30°C, Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM, Thermal Resistance @ Natural: 19.70°C/W, Fin Height: 0.515" (13.08mm), Material Finish: Tin.
Weitere Produktangebote 7136DG nach Preis ab 1.38 EUR bis 8.13 EUR
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7136DG | Boyd Corporation |
 Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin |
auf Bestellung 6000 Stücke: Lieferzeit 14-21 Tag (e) |
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7136DG | Boyd Corporation |
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin |
auf Bestellung 2190 Stücke: Lieferzeit 14-21 Tag (e) |
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7136DG | Boyd Corporation |
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin |
auf Bestellung 2190 Stücke: Lieferzeit 14-21 Tag (e) |
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7136DG | Boyd Laconia, LLC |
Description: BOARD LEVEL HEATSINK .515"TO-220 Packaging: Bulk Material: Copper Length: 0.848" (21.55mm) Shape: Rectangular, Fins Type: Board Level, Vertical Width: 0.520" (13.21mm) Package Cooled: TO-220 Attachment Method: Clip and PC Pin Power Dissipation @ Temperature Rise: 1.0W @ 30°C Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM Thermal Resistance @ Natural: 19.70°C/W Fin Height: 0.515" (13.08mm) Material Finish: Tin |
auf Bestellung 1918 Stücke: Lieferzeit 10-14 Tag (e) |
|
| 7136DG |
|
Hersteller: Boyd Corporation
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin
auf Bestellung 6000 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3000+ | 1.45 EUR |
| 6000+ | 1.38 EUR |
| 7136DG |
|
Hersteller: Boyd Corporation
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin
auf Bestellung 2190 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 28+ | 6.3 EUR |
| 7136DG |
|
Hersteller: Boyd Corporation
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin
Heat Sink Passive TO-220 Thru-Hole Copper 19.7°C/W Matte Tin
auf Bestellung 2190 Stücke:
Lieferzeit 14-21 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 28+ | 6.3 EUR |
| 7136DG |
|
Hersteller: Boyd Laconia, LLC
Description: BOARD LEVEL HEATSINK .515"TO-220
Packaging: Bulk
Material: Copper
Length: 0.848" (21.55mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.520" (13.21mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 19.70°C/W
Fin Height: 0.515" (13.08mm)
Material Finish: Tin
Description: BOARD LEVEL HEATSINK .515"TO-220
Packaging: Bulk
Material: Copper
Length: 0.848" (21.55mm)
Shape: Rectangular, Fins
Type: Board Level, Vertical
Width: 0.520" (13.21mm)
Package Cooled: TO-220
Attachment Method: Clip and PC Pin
Power Dissipation @ Temperature Rise: 1.0W @ 30°C
Thermal Resistance @ Forced Air Flow: 6.00°C/W @ 500 LFM
Thermal Resistance @ Natural: 19.70°C/W
Fin Height: 0.515" (13.08mm)
Material Finish: Tin
auf Bestellung 1918 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Privatkunde |
|---|---|
| 3+ | 8.13 EUR |
| 10+ | 7.19 EUR |
| 25+ | 6.84 EUR |
| 50+ | 6.59 EUR |
| 100+ | 6.35 EUR |
| 250+ | 6.06 EUR |
| 500+ | 5.84 EUR |