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714-43-112-31-018000 Mill-Max


2017-11%3A077.pdf
Hersteller: Mill-Max
IC & Component Sockets STANDARD RECEPTACLE CARRIER
auf Bestellung 9 Stücke:
Lieferzeit 10-14 Tag (e)
AnzahlPrivatkunde
1+22.12 EUR
10+19.6 EUR
17+18.85 EUR
51+18.1 EUR
102+17.09 EUR
255+15.58 EUR
510+14.58 EUR
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Technische Details 714-43-112-31-018000 Mill-Max

Description: CONN SOCKET SIP 12POS GOLD, Contact Material - Post: Brass Alloy, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Finish - Post: Gold, Pitch - Post: 0.100" (2.54mm), Contact Material - Mating: Beryllium Copper, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Finish - Mating: Gold, Pitch - Mating: 0.100" (2.54mm), Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Termination: Solder, Number of Positions or Pins (Grid): 12 (1 x 12), Operating Temperature: -55°C ~ 125°C, Type: SIP, Mounting Type: Through Hole, Features: Carrier, Packaging: Tube.

Weitere Produktangebote 714-43-112-31-018000

Foto Bezeichnung Hersteller Beschreibung Verfügbarkeit Privatkunde
714-43-112-31-018000 714-43-112-31-018000 DigiKey 2017-11%3A077.pdf Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Features: Carrier
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH
714-43-112-31-018000 2017-11%3A077.pdf
Hersteller: DigiKey
Description: CONN SOCKET SIP 12POS GOLD
Contact Material - Post: Brass Alloy
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Finish - Post: Gold
Pitch - Post: 0.100" (2.54mm)
Contact Material - Mating: Beryllium Copper
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Finish - Mating: Gold
Pitch - Mating: 0.100" (2.54mm)
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Termination: Solder
Number of Positions or Pins (Grid): 12 (1 x 12)
Operating Temperature: -55°C ~ 125°C
Type: SIP
Mounting Type: Through Hole
Features: Carrier
Packaging: Tube
Produkt ist nicht verfügbar
Im Einkaufswagen  Stück im Wert von  UAH