714-43-204-31-018000 DigiKey
Hersteller: DigiKeyDescription: CONN IC DIP SOCKET 4POS GOLD
Packaging: Bulk
Features: Carrier, Closed Frame
Mounting Type: Through Hole
Type: DIP, 0.1" (2.54mm) Row Spacing
Operating Temperature: -55°C ~ 125°C
Number of Positions or Pins (Grid): 4 (2 x 2)
Termination: Solder
Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
Pitch - Mating: 0.100" (2.54mm)
Contact Finish - Mating: Gold
Contact Finish Thickness - Mating: 30.0µin (0.76µm)
Contact Material - Mating: Beryllium Copper
Pitch - Post: 0.100" (2.54mm)
Contact Finish - Post: Gold
Contact Finish Thickness - Post: 30.0µin (0.76µm)
Contact Material - Post: Brass Alloy
Part Status: Active
auf Bestellung 1463 Stücke:
Lieferzeit 10-14 Tag (e)
| Anzahl | Preis |
|---|---|
| 5+ | 4.14 EUR |
| 10+ | 3.51 EUR |
| 25+ | 3.29 EUR |
| 50+ | 3.13 EUR |
| 100+ | 2.98 EUR |
| 250+ | 2.79 EUR |
| 500+ | 2.66 EUR |
| 1000+ | 2.53 EUR |
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Technische Details 714-43-204-31-018000 DigiKey
Description: CONN IC DIP SOCKET 4POS GOLD, Packaging: Bulk, Features: Carrier, Closed Frame, Mounting Type: Through Hole, Type: DIP, 0.1" (2.54mm) Row Spacing, Operating Temperature: -55°C ~ 125°C, Number of Positions or Pins (Grid): 4 (2 x 2), Termination: Solder, Housing Material: Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Pitch - Mating: 0.100" (2.54mm), Contact Finish - Mating: Gold, Contact Finish Thickness - Mating: 30.0µin (0.76µm), Contact Material - Mating: Beryllium Copper, Pitch - Post: 0.100" (2.54mm), Contact Finish - Post: Gold, Contact Finish Thickness - Post: 30.0µin (0.76µm), Contact Material - Post: Brass Alloy, Part Status: Active.
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