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74LV367PW,118

74LV367PW,118 NXP USA Inc.


74LV367.pdf Hersteller: NXP USA Inc.
Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Bulk
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
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Lieferzeit 10-14 Tag (e)
Anzahl Preis ohne MwSt
1025+0.48 EUR
Mindestbestellmenge: 1025
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Technische Details 74LV367PW,118 NXP USA Inc.

Description: IC BUF NON-INVERT 3.6V 16TSSOP, Packaging: Tape & Reel (TR), Package / Case: 16-TSSOP (0.173", 4.40mm Width), Output Type: 3-State, Mounting Type: Surface Mount, Number of Elements: 2, Logic Type: Buffer, Non-Inverting, Operating Temperature: -40°C ~ 125°C (TA), Voltage - Supply: 1V ~ 3.6V, Number of Bits per Element: 2, 4 (Hex), Current - Output High, Low: 8mA, 8mA, Supplier Device Package: 16-TSSOP.

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74LV367PW,118 74LV367PW,118 Hersteller : NXP USA Inc. 74LV367.pdf Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Tape & Reel (TR)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar
74LV367PW,118 74LV367PW,118 Hersteller : NXP USA Inc. 74LV367.pdf Description: IC BUF NON-INVERT 3.6V 16TSSOP
Packaging: Cut Tape (CT)
Package / Case: 16-TSSOP (0.173", 4.40mm Width)
Output Type: 3-State
Mounting Type: Surface Mount
Number of Elements: 2
Logic Type: Buffer, Non-Inverting
Operating Temperature: -40°C ~ 125°C (TA)
Voltage - Supply: 1V ~ 3.6V
Number of Bits per Element: 2, 4 (Hex)
Current - Output High, Low: 8mA, 8mA
Supplier Device Package: 16-TSSOP
Produkt ist nicht verfügbar